G01R 1/073

Sub-Class

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Description

Class  G01R : MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES


Subclass 1/073: Details of instruments or arrangements of the types included in groups G01R 5/00-G01R 13/00 and G01R 31/00 (constructional details particular to arrangements for measuring the electric consumption G01R 11/02) General constructional details (details of a kind applicable to measuring arrangements not specially adapted for a specific variable G01D 7/00) Measuring leads; Measuring probes (G01R 19/145, G01R 19/165 take precedence; end pieces for leads H01R 11/00) Measuring probes Multiple probes

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12265101 Load pull tuner for waveguide wafer probeApr 12, 23Apr 01, 25Not available
12259407 Contact probe for probe heads of electronic devicesAug 03, 21Mar 25, 25Technoprobe S.p.A,
12259419 Test device and probe polishing methodOct 20, 21Mar 25, 25Tokyo Electron Limited
12253542 Needle block for easy adjustment of tip length of needle unitDec 05, 22Mar 18, 25WILLTECHNOLOGY CO. LTD.
12248001 Lidless BGA socket apparatus for testing semiconductor deviceApr 15, 19Mar 11, 25HICON CO., LTD.;
12248003 Clustered rigid wafer test probeDec 06, 22Mar 11, 25International Business Machine Corporation
12248004 Membrane probe card and its probe headApr 22, 22Mar 11, 25MAXONE SEMICONDUCTOR CO., LTD.
12248012 Method for producing a probe used for testing integrated electronic circuitsSep 22, 23Mar 11, 25STMicroelectronics S.r.l.
12241926 Test apparatusOct 27, 21Mar 04, 25Advantest Corporation; TOEI SCIENTIFIC INDUSTRIAL CO., LTD.;
12241930 Wafer test system and operating method thereofNov 03, 22Mar 04, 25SK HYNIX INC.
12243703 Probe card device and circuit protection assembly thereofJun 30, 22Mar 04, 25GLOBAL UNICHIP CORPORATION; TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.;
12244083 Electrical connecting apparatusDec 13, 19Mar 04, 25Kabushiki Kaisha Nihon Micronics
12235287 Substrate processing apparatusSep 09, 22Feb 25, 25Samsung Electronics Co. Ltd.
12235313 Composite intermediary device using vertical probe for wafer testingApr 17, 23Feb 25, 25SYU GUANG TECHNOLOGY CO., LTD.
12235314 Parallel test cell with self actuated socketsJul 29, 22Feb 25, 25ADVANTEST TEST SOLUTIONS, INC.
12228590 Wafer probe deviceSep 19, 23Feb 18, 25Winbond Electronics Corp.
12228591 Busbar as current sensorNov 25, 20Feb 18, 25EATON INTELLIGENT POWER LIMITED
12222367 Contact pins for test sockets and test sockets comprising the sameApr 04, 23Feb 11, 25Okins Electronics Co. Ltd.
12222369 MEMS probe cardJul 27, 21Feb 11, 25MAXONE SEMICONDUCTOR CO., LTD.
12222370 Probe head and probe card having sameApr 20, 21Feb 11, 25POINT ENGINEERING CO., LTD.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0116,685 PROBE STORAGE JIG, PROBE STORAGE SYSTEM, AND PROBE STORAGE METHODOct 24, 22Apr 10, 25Not available
2025/0116,686 MEASURING DEVICEJun 14, 21Apr 10, 25Fuji Corporation
2025/0110,153 PROBE CARD AND THERMAL CONDUCTION DEVICE THEREOFDec 22, 23Apr 03, 25Not available
2025/0110,154 PROBE CARD DEVICEDec 13, 23Apr 03, 25Not available
2025/0110,177 CHARGE/DISCHARGE INSPECTION DEVICE AND CHARGE/DISCHARGE INSPECTION EQUIPMENTDec 13, 24Apr 03, 25Not available
2025/0102,540 PROBE ASSEMBLY WITH MULTIPLE SPACERS AND METHODS OF ASSEMBLING THE SAMEDec 08, 24Mar 27, 25Not available
2025/0093,384 PROBER, PERFORMANCE BOARD, PROBE CARD, AND SUBSTRATE INSPECTING APPARATUSAug 28, 24Mar 20, 25Kioxia Corporation
2025/0093,386 WAFER TESTING CASSETTEMar 29, 24Mar 20, 25Not available
2025/0093,412 PROBE STRUCTURE FOR MICRO DEVICE INSPECTIONDec 03, 24Mar 20, 25VueReal Inc.
2025/0093,385 PROBE HEAD STRUCTURES FOR CIRCUIT PROBE TEST SYSTEMS AND METHODS OF FORMING THE SAMENov 14, 23Mar 20, 25Not available
2025/0093,407 METHOD OF HAVING GOOD THERMAL ISOLATION IN WAFER TEST CASSETTEMar 29, 24Mar 20, 25Not available
2025/0085,309 LOW CROSS-TALK INTERCONNECTION DEVICE WITH IMPEDANCE-TUNED HYBRID SHIELDING STRUCTURES FOR INTEGRATED CIRCUIT DEVICE TEST TOOLINGMay 20, 24Mar 13, 25Not available
2025/0085,311 COMPOSITE PROBE, METHOD FOR ATTACHING PROBE, AND METHOD FOR MANUFACTURING PROBE CARDMar 16, 22Mar 13, 25Japan Electronic Materials Corporation
2025/0087,526 SEMICONDUCTOR MANUFACTURING APPARATUSFeb 08, 24Mar 13, 25Not available
2025/0076,342 Apparatus, System and Method for Repairing a Test Contact ArrangementMar 16, 23Mar 06, 25Not available
2025/0076,366 SEMICONDUCTOR WAFER HANDLING APPARATUS AND SEMICONDUCTOR WAFER TESTING SYSTEMAug 27, 24Mar 06, 25Advantest Corporation
2025/0076,372 INSPECTION METHOD AND INSPECTION APPARATUSAug 19, 24Mar 06, 25Not available
2025/0067,776 PROBE DEVICES AND PROBE CONTROL APPARATUSDec 19, 22Feb 27, 25Not available
2025/0071,889 FLEXIBLE CIRCUIT BOARDJul 31, 24Feb 27, 25Not available
2025/0060,405 TESTING MODULEOct 09, 24Feb 20, 25Not available

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Patents Issued To Date - By Filing Year

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