G01R 1/06

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Class  G01R : MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES


Subclass 1/06: Details of instruments or arrangements of the types included in groups G01R 5/00-G01R 13/00 and G01R 31/00 (constructional details particular to arrangements for measuring the electric consumption G01R 11/02) General constructional details (details of a kind applicable to measuring arrangements not specially adapted for a specific variable G01D 7/00) Measuring leads; Measuring probes (G01R 19/145, G01R 19/165 take precedence; end pieces for leads H01R 11/00)

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12092659 Safety system for needle probe card for high-voltage and high-current test on power semiconductor devices, related test machine and corresponding testing methodMay 27, 21Sep 17, 24CREA COLLAUDI ELETTRONICI AUTOMATIZZATI S.R.L.
12078658 Semiconductor probeApr 22, 21Sep 03, 24Not available
12066458 Conductive particle-disposed film having conductive particles disposed within an elastomer film, method for producing the same, test probe unit, and continuity test methodNov 20, 17Aug 20, 24DEXERIALS CORPORATION
12055562 Contact terminal, inspection jig, and inspection apparatusMar 11, 21Aug 06, 24Nidec Read Corporation
11982689 Probes having improved mechanical and/or electrical properties for making contact between electronic circuit elements and methods for makingJan 11, 22May 14, 24Microfabrica Inc.
11906569 Semiconductor wafer evaluation apparatus and semiconductor wafer manufacturing methodNov 05, 21Feb 20, 24EC-Showa Denko K.K.
11835567 Method for assembling ultrahigh-frequency spring probe test assemblySep 21, 21Dec 05, 23SUZHOU UIGREEN MICRO&NANO TECHNOLOGY CO. LTD.
11808787 Probe card testing deviceJun 09, 21Nov 07, 23Unimicron Technology Corp.
11740259 Method of manufacturing semiconductor deviceFeb 24, 22Aug 29, 23Renesas Electronics Corporation
11714117 Automated method to check electrostatic discharge effect on a victim deviceNov 22, 21Aug 01, 23Synopsys, Inc.
11498207 Test head manipulator configured to address uncontrolled test head rotationJan 08, 21Nov 15, 22Teradyne, Inc.
11464107 Board including multiple conductive pads corresponding to one contact, and electronic device for identifying conductive padsSep 26, 19Oct 04, 22Samsung Electronics Co. Ltd.
11372023 Slip-plane MEMs probe for high-density and fine pitch interconnectsFeb 11, 21Jun 28, 22Intel Corp.
11346865 Multi-use test leadNov 11, 19May 31, 22MEGGER INSTRUMENTS LTD
11269020 Method for testing solder balls between two substrates by using dummy solder ballsDec 23, 19Mar 08, 22Qisda Corporation
11092620 Conduction inspection device member and conduction inspection deviceAug 08, 17Aug 17, 21SEKISUI CHEMICAL CO., LTD.
11041809 Ultrahigh resolution dynamic IC chip activity detection for hardware securityOct 07, 16Jun 22, 21Harvard University President and Fellows of Harvard College
11021118 Wire harness manufacturing method and wire harnessMar 06, 19Jun 01, 21Yazaki Corporation
10935573 Slip-plane MEMS probe for high-density and fine pitch interconnectsSep 28, 18Mar 02, 21Intel Corp.
10908183 Active probe powered through driven coax cableNov 05, 18Feb 02, 21National Instruments Corporation

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