Class F04F : PUMPING OF FLUID BY DIRECT CONTACT OF ANOTHER FLUID OR BY USING INERTIA OF FLUID TO BE PUMPED
Subclass 1/14: Pumps using positively or negatively pressurised fluid medium acting directly on the liquid to be pumped (using only negative pressure F04F 3/00; jet pumps F04F 5/00; siphons F04F 10/00) the fluid medium acting on the surface of the liquid to be pumped (F04F 1/02 takes precedence) adapted to pump specific liquids, e.g. corrosive or hot liquids
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 11898578 | Heat-activated multiphase fluid-operated pump | Sep 10, 21 | Feb 13, 24 | Hamfop Technologies LLC |
| 11022102 | Methods of pumping heat transfer fluid in thermal energy storage systems | Feb 14, 18 | Jun 01, 21 | AZELIO AB |
| 11001492 | Device for sealing and evacuating a container containing a paste-like liquid | Apr 11, 18 | May 11, 21 | Not available |
| 10843143 | Dispensing system | Oct 29, 18 | Nov 24, 20 | Packaging Innovation Ltd |
| 10495055 | Low-energy and high pressure, hydraulic, pneumatic engine | Dec 15, 17 | Dec 03, 19 | Not available |
| 10400598 | Method for lifting of magmatic lava to the surface | Sep 29, 14 | Sep 03, 19 | Not available |
| 10036406 | Aligned-outlet and distal-flushable blow case | Oct 29, 14 | Jul 31, 18 | Not available |
| 9162410 | Compression of a water-saturated medium | May 09, 12 | Oct 20, 15 | LINDE AKTIENGESELLSCHAFT |
| 8940250 | Method of conveying liquids | Jul 06, 10 | Jan 27, 15 | BASF SE |
| 6176252 | Apparatus for supplying liquid in semiconductor manufacturing process | Aug 06, 99 | Jan 23, 01 | WINBOND ELECTRONICS CORP. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2022/0290,696 | BOUNDARY LAYER POWERED CIRCULATORY ASSIST DEVICE | Mar 10, 22 | Sep 15, 22 | Indiana University Research and Technology Corporation |
| Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More |
|---|
