C25F 3/00

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Class  C25F : PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR


Subclass 3/00: Electrolytic etching or polishing

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
11504770 Dissolving metal supports in 3D printed metals and ceramics using sensitizationFeb 16, 17Nov 22, 22Arizona Board of Regents on behalf of Arizona State University; The Penn State Research Foundation;
11401619 Sacrificial coating and procedure for electroplating aluminum on aluminum alloysMay 11, 18Aug 02, 22United Technologies Corporation
10730125 Apparatus and method for making extrusion diesNov 20, 15Aug 04, 20Corning Incorporated
10658143 Method of manufacturing emitterFeb 20, 19May 19, 20HITACHI HIGH-TECH SCIENCE CORPORATION
10584034 Method for DNA defined etching of a graphene nanostructureMay 25, 18Mar 10, 20Nu Promethean Technologies, Inc.
10501863 Forming method and formed articleAug 20, 15Dec 10, 19SEIKO EPSON CORPORATION
10465310 Method and apparatus for electrochemical etchingApr 28, 15Nov 05, 19The University of Durham
10361018 Method for producing a multi-layer component and multi-layer componentJun 06, 13Jul 23, 19Epcos AG
10312114 Substrate processing method, and substrate processing deviceOct 08, 14Jun 04, 19SCREEN Holdings Co., Ltd.
10273187 Metal oxide activated cementDec 18, 17Apr 30, 19Not available
10274819 EUV pellicle fabrication methods and structures thereofFeb 05, 15Apr 30, 19Taiwan Semiconductor Manufacturing Company, Ltd.
10260153 Methods and compositions for acid treatment of a metal surfaceJul 10, 17Apr 16, 19Houghton Technical Corp.
10240050 Process for preparing transparent conductive coatingsSep 19, 12Mar 26, 19Clearview Films Ltd.
10214823 Bimetallic zincating processing for enhanced adhesion of aluminum on aluminum alloysMar 11, 14Feb 26, 19United Technnologies Corporation
10211063 Substrate processing apparatus and substrate processing methodJul 29, 15Feb 19, 19SCREEN Holdings Co., Ltd.
10161055 Method of forming wiring pattern and etching apparatus for forming wiring patternMar 31, 16Dec 25, 18Toyota Jidosha Kabushiki Kaisha
10155903 Metal etchant compositions and methods of fabricating a semiconductor device using the sameMar 21, 16Dec 18, 18Samsung Electronics Co., Ltd.; Cornell University;
10077382 Method for polishing cobalt-containing substrateMar 06, 17Sep 18, 18Rohm and Haas Electronic Materials CMP Holdings, Inc.
9999943 Method of manufacturing a maskApr 06, 16Jun 19, 18Samsung Display Co., Ltd.
9981851 Method for DNA etching of a graphene nanostructureSep 09, 14May 29, 18Nu Promethean Technologies, Inc.

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Recent Publications

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