Description
Class B81C : PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS
Subclass 3/00: Assembling of devices or systems from individually processed components
B81C 3/00
Sub-Class
Stats
- 304 US PATENTS IN FORCE
- 39 US APPLICATIONS PENDING
- 88 Total Patent Owners
- 840 TOTAL INVENTORS
Recent Patents
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12258265 | Bonding process for forming semiconductor device structure | Jul 18, 23 | Mar 25, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12215018 | Method for manufacturing package structure | Mar 19, 24 | Feb 04, 25 | Winbond Electronics Corp. |
| 12202725 | Method for bonding wafers, and a wafer | Mar 10, 22 | Jan 21, 25 | Murata Manufacturing Co Ltd. |
| 12194464 | Integrated microfluidic system and method of fabrication | Apr 04, 22 | Jan 14, 25 | Corporation for National Research Initiatives |
| 12188925 | Multi-stage, multiplexed target isolation and processing from heterogeneous populations | Jan 29, 21 | Jan 07, 25 | THE BROAD INSTITUTE, INC.; The General Hospital Corporation; Massachusetts Institute of Technology; |
| 12168605 | Semiconductor device package and a method of manufacturing the same | May 25, 21 | Dec 17, 24 | Advanced Semiconductor Engineering Inc. |
| 12139399 | Conductive bond structure to increase membrane sensitivity in MEMS device | Mar 29, 22 | Nov 12, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12134824 | Undercut-free patterned aluminum nitride structure and methods for forming the same | Jun 17, 22 | Nov 05, 24 | Taiwan Semiconductor Manufacturing Company Limited |
| 12129168 | Microelectronics package with vertically stacked MEMS device and controller device | Nov 24, 20 | Oct 29, 24 | Qorvo US, Inc. |
| 12122666 | Microelectronics H-frame device | Mar 11, 21 | Oct 22, 24 | Northrop Grumman Systems Corporation |
| 12116303 | Method of bonding substrates and separating a portion of the bonded substrates through the bond, such as to manufacture an array of liquid lenses and separate the array into individual liquid lenses | Aug 11, 20 | Oct 15, 24 | Corning Incorporated |
| 12103246 | Method of bonding substrates, microchip and method of manufacturing the same | Nov 15, 17 | Oct 01, 24 | Ushio Denki Kabushiki Kaisha |
| 12091308 | Microchannel chip and method for manufacturing same | May 24, 21 | Sep 17, 24 | Zeon Corporation |
| 12017214 | Multilayer fluidic devices and methods for their fabrication | Aug 24, 21 | Jun 25, 24 | Illumina Inc. |
| 12012329 | Carbyne-based sensing device for high spatial resolution in DNA sequencing and biomolecule characterization and method of fabricating the same | Feb 11, 21 | Jun 18, 24 | Board of Trustees of the University of Arkansas |
| 11993512 | Dual micro-electro mechanical system and manufacturing method thereof | Mar 14, 22 | May 28, 24 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 11990435 | Fingerprint sensor and manufacturing method thereof | Jul 18, 22 | May 21, 24 | Amkor Technology Singapore Holding Pte Ltd. |
| 11973048 | Semiconductor package and method for manufacturing the same | Nov 08, 21 | Apr 30, 24 | Advanced Semiconductor Engineering Inc. |
| 11970388 | Package structure and method for manufacturing the same | Dec 14, 21 | Apr 30, 24 | Winbond Electronics Corp. |
| 11948847 | Bonded structures | May 31, 22 | Apr 02, 24 | ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. |
Recent Publications
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0011,160 | METHOD FOR FABRICATING A MICROELECTRONICS H-FRAME DEVICE | Sep 26, 24 | Jan 09, 25 | Not available |
| 2025/0002,330 | MICROELECTRONICS PACKAGE WITH VERTICALLY STACKED MEMS DEVICE AND CONTROLLER DEVICE | Sep 13, 24 | Jan 02, 25 | Not available |
| 2025/0002,332 | MICROELECTROMECHANICAL SENSOR DEVICE WITH WAFER-LEVEL INTEGRATION OF PRESSURE AND INERTIAL DETECTION STRUCTURES AND CORRESPONDING MANUFACTURING PROCESS | Jun 17, 24 | Jan 02, 25 | STMicroelectronics International N.V. |
| 2024/0425,367 | DIE STACKING WITH CONTROLLED ANGULAR ALIGNMENT | Jun 20, 23 | Dec 26, 24 | Not available |
| 2024/0375,099 | MULTILAYER FLUIDIC DEVICES AND METHODS FOR THEIR FABRICATION | Jun 21, 24 | Nov 14, 24 | Not available |
| 2024/0368,746 | UNDERCUT-FREE PATTERNED ALUMINUM NITRIDE STRUCTURE AND METHODS FOR FORMING THE SAME | Jul 21, 24 | Nov 07, 24 | Not available |
| 2024/0367,965 | CONDUCTIVE BOND STRUCTURE TO INCREASE MEMBRANE SENSITIVTY IN MEMS DEVICE | Jul 19, 24 | Nov 07, 24 | Not available |
| 2024/0304,577 | FINGERPRINT SENSOR AND MANUFACTURING METHOD THEREOF | May 17, 24 | Sep 12, 24 | Not available |
| 2024/0262,681 | DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOF | Apr 19, 24 | Aug 08, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2024/0262,683 | HIGH-PRECISION ALIGNMENT METHOD FOR PRODUCING A DEVICE, AND DEVICE | May 18, 22 | Aug 08, 24 | Not available |
| 2024/0253,974 | SYSTEMS AND METHODS FOR WAFER DIE ASSEMBLY BONDING | Jan 26, 23 | Aug 01, 24 | Rosemount Aerospace Inc. |
| 2024/0162,102 | BONDED STRUCTURES | Dec 19, 23 | May 16, 24 | Not available |
| 2024/0120,245 | BONDED STRUCTURES | Dec 19, 23 | Apr 11, 24 | Not available |
| 2024/0092,631 | MEMS SENSOR AND MANUFACTURING METHOD THEREOF | Sep 08, 23 | Mar 21, 24 | ROHM CO., LTD. |
| 2024/0043,264 | MEMS DEVICE MANUFACTURING | Dec 09, 21 | Feb 08, 24 | OBSIDIAN SENSORS, INC. |
| 2024/0036,345 | METHOD AND APPARATUS FOR THE OPTICAL CONTACT BONDING OF COMPONENTS | Oct 12, 23 | Feb 01, 24 | Not available |
| 2024/0017,987 | Anchor Structure | Apr 03, 23 | Jan 18, 24 | Not available |
| 2023/0406,698 | MICROELECTROMECHANICAL ELEMENT AND A METHOD FOR MANUFACTURING IT | Jun 13, 23 | Dec 21, 23 | Not available |
| 2023/0364,604 | Attachment Method for Microfluidic Device | Feb 06, 23 | Nov 16, 23 | Not available |
| 2023/0365,400 | ENCAPSULATION STRUCTURE, SUBSTRATE, AND ENCAPSULATION METHOD | Jul 28, 23 | Nov 16, 23 | Not available |
Top Owners in This Subclass
| Upgrade to the Professional Level to view Top Owners for this Subclass.Learn More |
|---|
Patents Issued To Date - By Filing Year
Average Time to Issuance
- 27 Months (last 2 years Issuances)
- 27 Months (last 5 years Issuances)