Class B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
Subclass 3/04: Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00) Heating appliances (soldering lamps or blow-pipes F23D; electric heating in general H05B)
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12246387 | Device for shifting at least one sub-assembly between a provisioning zone and working zone | Jul 27, 21 | Mar 11, 25 | WERKZEUGBAU SIEGFRIED HOFMANN GMBH |
| 12214436 | Laser soldering system and light shaping method thereof | Dec 08, 21 | Feb 04, 25 | Delta Electronics Inc. |
| 12168830 | System for treating hydrogen and/or oxygen gas produced by water electrolysis serving to supply a combustion process | Apr 25, 18 | Dec 17, 24 | Bulane |
| 12138703 | Apparatus and method for hard facing a substrate | Aug 13, 20 | Nov 12, 24 | CUTTING & WEAR RESISTANT DEVELOPMENTS LIMITED |
| 12053833 | Method and hot-forming die for producing a heat transfer plate | Jan 09, 23 | Aug 06, 24 | Benteler Automobiltechnik GmbH |
| 11845137 | Apparatuses and methods for induction heating | Dec 17, 19 | Dec 19, 23 | US Synthetic Corporation |
| 11819952 | Soldering apparatus and method of detecting failures of gasket | May 24, 21 | Nov 21, 23 | Senju Metal Industry Co. LTD |
| 11780022 | Reliable transportation mechanism for micro solder balls | Jun 25, 20 | Oct 10, 23 | Western Digital Technologies, Inc. |
| 11697168 | Reflow oven with a controllably connected blocked exhaust zone | Apr 18, 19 | Jul 11, 23 | Illinois Tool Works Inc. |
| 11682650 | Heat assisted flip chip bonding apparatus | Nov 23, 21 | Jun 20, 23 | National Pingtung University of Science and Technology |
| 11574888 | Component joining apparatus, component joining method and mounted structure | Nov 29, 18 | Feb 07, 23 | Panasonic Intellectual Property Management Co., Ltd. |
| 11554434 | Method and laser arrangement for fusing a solder material deposit by means of laser energy | Feb 14, 18 | Jan 17, 23 | Pac Tech—Packaging Technologies GmbH |
| 11524351 | Multistage joining process with thermal sprayed layers | Dec 19, 18 | Dec 13, 22 | OUTOKUMPU OYJ |
| 11504786 | Reflow soldering system for combined convection soldering and condensation soldering | Aug 28, 20 | Nov 22, 22 | Rehm Thermal Systems GmbH |
| 11491631 | Gas powered tool and a method for retaining an isolating valve of a gas powered tool in an isolating state | May 08, 18 | Nov 08, 22 | Oglesby & Butler Research & Development Limited |
| 11420282 | Soldering device | Nov 27, 17 | Aug 23, 22 | Hitachi, Ltd. |
| 11351623 | Heat transfer device for producing a soldered connection of electrical components | Feb 10, 20 | Jun 07, 22 | Pink GmbH Thermosysteme |
| 11311956 | Soldering apparatus | Aug 23, 21 | Apr 26, 22 | Senju Metal Industry Co. LTD |
| 11305364 | Apparatus and method for attaching interconnector of solar cell panel | Apr 30, 19 | Apr 19, 22 | LG Electronics Inc. |
| 11090751 | Reflow device and method for manufacturing substrate using the reflow device | May 09, 19 | Aug 17, 21 | DENSO Corporation |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0100,059 | HEAT TREATMENT FURNACE APPARATUS | Dec 09, 24 | Mar 27, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0085,055 | REFLOW OVEN | Jul 26, 22 | Mar 13, 25 | Not available |
| 2025/0087,625 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | Jan 11, 24 | Mar 13, 25 | Not available |
| 2025/0077,904 | METHOD FOR DETERMINING TEMPERATURE OF REFLOW OVEN, ELECTRONIC DEVICE AND STORAGE MEDIUM | Oct 25, 23 | Mar 06, 25 | Not available |
| 2025/0033,131 | SELF CORRECTING OVEN TECHNOLOGY | Dec 07, 22 | Jan 30, 25 | Not available |
| 2025/0033,132 | SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICE | Jun 20, 24 | Jan 30, 25 | Not available |
| 2024/0426,555 | SYSTEM AND METHOD FOR DETERMINING WHETHER TO CLEAN A REFLOW OVEN | Jun 05, 24 | Dec 26, 24 | Not available |
| 2024/0261,883 | BRAZING METHOD AND BRAZING APPARATUS FOR BRAZING METAL PLATES | Feb 05, 24 | Aug 08, 24 | c/o TOYOTA JIDOSHA KABUSHIKI KAISHA |
| 2024/0173,788 | METHOD AND AUTOMATIC BRAZING APPARATUS FOR FLAME BRAZING CONTROL IN COPPER-ALUMINUM WELDING | Dec 30, 22 | May 30, 24 | Not available |
| 2024/0042,539 | Soldering Apparatus And Method Of Detecting Failures Of Gasket | Oct 17, 23 | Feb 08, 24 | Senju Metal Industry Co. LTD |
| 2024/0009,746 | BRAZING PROBE | Jun 30, 23 | Jan 11, 24 | Not available |
| 2023/0347,437 | SOLDERING DEVICE | Aug 25, 21 | Nov 02, 23 | Senju Metal Industry Co. LTD |
| 2023/0219,156 | BRAZE JOINTS FOR A COMPONENT AND METHODS OF FORMING THE SAME | Mar 21, 23 | Jul 13, 23 | Not available |
| 2023/0117,585 | CONTROL DEVICE FOR PERFORMING BRAZING, BRAZING SYSTEM, AND BRAZING METHOD | Mar 29, 21 | Apr 20, 23 | FANUC Corporation |
| 2022/0320,811 | LASER SOLDERING METHOD AND DEVICE | Sep 26, 19 | Oct 06, 22 | Not available |
| 2020/0376,580 | Soldering Device | Nov 27, 17 | Dec 03, 20 | Not available |
| 2017/0072,491 | Soldering Device Minimizing Voids When Soldering Printed Circuit Boards | Nov 02, 16 | Mar 16, 17 | Not available |
| 2015/0129,648 | Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said Method | Nov 03, 14 | May 14, 15 | ERSA GMBH |
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