B23K 1/08

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Description

Class  B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM


Subclass 1/08: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering by means of dipping in molten solder

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12157153 Method for the manufacture of insoluble lead anodes, used in electrowinning or electro-refining processes of high purity metalsMar 05, 21Dec 03, 24ÁNODOS DE CHILE S.A.
12114703 Aerosol provision deviceMar 09, 20Oct 15, 24NICOVENTURES TRADING LIMITED
12094624 Lamination structure of second generation high-temperature superconducting (2G-HTS) tape and method for fabricating the sameOct 18, 23Sep 17, 24SuperMag Technology (Shanghai) Ltd.
11969828 Prevention of dripping of material for material injectionApr 06, 23Apr 30, 24IBM Corporation
11964345 Moving unit for moving two soldering assemblies for processing circuits boards, and soldering system for selective wave soldering with a moving unitMay 03, 22Apr 23, 24ERSA GMBH
11850684 Wave solder pallets for optimal solder flow and methods of manufacturingFeb 11, 20Dec 26, 23Flex Ltd.
11684988 Prevention of dripping of material for material injectionMar 09, 22Jun 27, 23IBM Corporation
11548086 Method for selectively pretinning a guidewire coreDec 20, 19Jan 10, 23Abbott Cardiovascular Systems Inc.
11517970 Method and system for tin immersion and soldering of core wireDec 14, 17Dec 06, 22GOERTEK INC.
11516924 Protective heat shields for thermally sensitive components and methods for protecting thermally sensitive componentsFeb 11, 20Nov 29, 22Flex Ltd.
11458558 Soldering nozzle and soldering installationMar 01, 19Oct 04, 22ERSA GMBH
11411150 Advanced solder alloys for electronic interconnectsJan 25, 19Aug 09, 22Alpha Assembly Solutions Inc.
11389888 Wave solder nozzle with automated exit wingAug 17, 20Jul 19, 22Illinois Tool Works Inc.
11298769 Prevention of dripping of material for material injectionMay 13, 19Apr 12, 22IBM Corporation
11292069 Soldering system with monitoring unitJul 02, 18Apr 05, 22ERSA GMBH
11285299 Mold for forming solder distal tip for guidewireOct 31, 19Mar 29, 22Abbott Cardiovascular Systems Inc.
11267063 Method for operating a soldering device, soldering deviceJul 02, 18Mar 08, 22ERSA GMBH
11235406 High-efficiency soldering apparatus for winding head of flat-wire motor and soldering processDec 30, 19Feb 01, 22HEFEI JEE POWER SYSTEMS Co., Ltd.
11167364 Jet solder bath and jet soldering apparatusAug 01, 18Nov 09, 21Senju Metal Industry Co., Ltd.
11154916 Method for cleaning a solder nozzle of a soldering systemJul 02, 18Oct 26, 21ERSA GMBH

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0041,958 SELF CORRECTING WAVE SOLDERING MACHINEDec 07, 22Feb 06, 25Not available
2024/0359,245 CALIBRATION OF A SOLDERING MACHINEAug 25, 22Oct 31, 24Not available
2024/0051,051 ULTRA-THIN SOLDERING GASKET AND PREPARATION METHOD THEREFOR, SOLDERING METHOD, AND SEMICONDUCTOR DEVICEDec 13, 21Feb 15, 24NINGBO S J ELECTRONICS CO., LTD.
2023/0390,846 JET SOLDERING APPARATUSMay 09, 22Dec 07, 23Not available
2020/0346,293 PERIPHERAL COATING PROCESS OF THE COPPER CONDUCTIVE BAR FOR THE MANUFACTURE OF ANODES, USED IN THE PROCESSES OF ELECTRO-OBTAINING OR ELECTRO-REFINING OF METALSMay 01, 20Nov 05, 20HORACIO RAFART E HIJOS SPA.
2020/0290,143 Jet Solder Level Confirmation Jig and Method of Handling the SameNov 27, 18Sep 17, 20Not available
2019/0381,590 WAVE SOLDER NOZZLE WITH AUTOMATED ADJUSTABLE SLIDING PLATE TO VARY SOLDER WAVE WIDTHJun 14, 18Dec 19, 19Not available
2019/0160,572 INJECTION-MOLDED SOLDER (IMS) TOOL ASSEMBLY AND METHOD OF USE THEREOFNov 29, 17May 30, 19International Business Machines Corporation
2018/0093,340 SOLDERING DEVICE AND SOLDERING SYSTEMSep 27, 17Apr 05, 18ERSA GMBH

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Patents Issued To Date - By Filing Year

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