B23K 1/06

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Description

Class  B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM


Subclass 1/06: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) making use of vibrations, e.g. supersonic vibrations

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
11724326 Method and device for liquid spray soldering and the application method thereofSep 01, 22Aug 15, 23Shenzhen Anewbest Electronic Technology Co., Ltd.
11541472 Ultrasonic-assisted solder transferJan 29, 20Jan 03, 23International Business Machine Corporation
11462506 Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the sameApr 06, 21Oct 04, 22Kulicke and Soffa Industries Inc.
11387581 Electric wire connection structureDec 19, 19Jul 12, 22FURUKAWA ELECTRIC CO., LTD.; FURUKAWA AUTOMOTIVE SYSTEMS INC.;
11302667 Method of vertically vibrating a bonding armAug 26, 20Apr 12, 22Kaijo Corporation
11292209 Ultrasonic processing system, booster and methodFeb 13, 17Apr 05, 22TELSONIC HOLDING AG
11035168 Method and apparatus for an insulating glazing unit and compliant seal for an insulating glazing unitNov 05, 18Jun 15, 21ASTRAVAC GLASS, INC.
11011492 Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the sameJun 27, 19May 18, 21Kulicke and Soffa Industries Inc.
10879211 Method of joining a surface-mount component to a substrate with solder that has been temporarily securedDec 08, 16Dec 29, 20R.S.M. Electron Power, Inc.
10758997 Exothermic welding apparatus and exothermic welding methodJun 28, 18Sep 01, 20SICHUAN SUNLIGHT INTELLIGENT ELECTRIC EQUIPMENT CO., LTD. . .
10664007 Techniques for joining one or more structures of an electronic deviceSep 20, 18May 26, 20Apple Inc.
10562127 Ribbon bonding tools, and methods of designing ribbon bonding toolsApr 30, 18Feb 18, 20Kulicke and Soffa Industries Inc.
10554004 Sonotrode, device and method for producing a joinJul 13, 16Feb 04, 20TELSONIC HOLDING AG
10500663 Method of tight crack braze repair using acousticsAug 31, 16Dec 10, 19Siemens Energy Inc.
10478915 Joining methodJul 11, 17Nov 19, 19ULTEX CORPORATION
10449627 Wedge bonding tools, wedge bonding systems, and related methodsMar 16, 18Oct 22, 19KULICKE AND SOFFA INDUSTRIES, INC.
10443958 Powdered metal as a sacrificial material for ultrasonic additive manufacturingApr 25, 16Oct 15, 19Raytheon Company
10381321 Ultrasonic transducer systems including tuned resonators, equipment including such systems, and methods of providing the sameFeb 12, 18Aug 13, 19Kulicke and Soffa Industries Inc.
10305239 Pane comprising an electrical connection elementApr 17, 12May 28, 19SAINT - GOBAIN GLASS FRANCE
10286473 Method for producing a disk with an electrically conductive coating and a metal strip which is soldered onto the disk; and corresponding diskAug 19, 15May 14, 19SAINT - GOBAIN GLASS FRANCE

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2024/0139,847 BRAZING JOINT, BRAZING METHOD AND DEVICE, FOR PROMOTING SOLDER RHEOLOGY AND GAS OVERFLOWDec 09, 22May 02, 24CHINA ACADEMY OF MACHINERY NINGBO ACADEMY OF INTELLIGENT MACHINE TOOL CO., LTD.; ZHENGZHOU RESEARCH INSTITUTE OF MECHANICAL ENGINEERING CO., LTD.;
2023/0278,126 METHOD AND DEVICE FOR LIQUID SPRAY SOLDERING AND THE APPLICATION METHOD THEREOFSep 01, 22Sep 07, 23Not available
2022/0329,029 METHOD FOR BONDING FLEXIBLE ELECTRONIC CIRCUIT ELEMENTSFeb 18, 22Oct 13, 22Not available
2022/0219,254 METHOD OF CONNECTION TO A CONDUCTIVE MATERIALJan 12, 22Jul 14, 22Carlex Glass America, LLC
2020/0164,452 METHOD OF JOINING A NIOBIUM TITANIUM ALLOY BY USING AN ACTIVE SOLDERMay 11, 18May 28, 20Not available
2017/0072,491 Soldering Device Minimizing Voids When Soldering Printed Circuit BoardsNov 02, 16Mar 16, 17Not available
2016/0256,948 FLUX-LESS DIRECT SOLDERING BY ULTRASONIC SURFACE ACTIVATIONOct 21, 14Sep 08, 16NORTHWESTERN UNIVERSITY
2015/0129,648 Method For Minimizing Voids When Soldering Printed Circuit Boards And Soldering Device For Carrying Out Said MethodNov 03, 14May 14, 15ERSA GMBH

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Patents Issued To Date - By Filing Year

Average Time to Issuance