Class B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
Subclass 1/018: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Unsoldering; Removal of melted solder or other residues
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12040311 | Substrate debonding from bonded part | Dec 22, 22 | Jul 16, 24 | The Boeing Company |
| 12016127 | Liquid metal infiltration rework of electronic assembly | Jul 19, 23 | Jun 18, 24 | International Business Machine Corporation |
| 11996384 | Method and apparatus for debonding temporarily bonded wafers in wafer-level packaging applications | Dec 15, 20 | May 28, 24 | PulseForge Inc. |
| 11751369 | Liquid metal infiltration rework of electronic assembly | Apr 04, 22 | Sep 05, 23 | International Business Machine Corporation |
| 11745281 | Solder removal from semiconductor devices | May 04, 21 | Sep 05, 23 | Micron Technology Inc. |
| 11553631 | Systems and methods for removing an adhesively-attached component from a circuit board assembly | Nov 20, 20 | Jan 10, 23 | Raytheon Company |
| 11445650 | Localized rework using liquid media soldering | Oct 22, 19 | Sep 13, 22 | International Business Machine Corporation |
| 11343950 | Rotational removal of electronic chips and other components from printed wire boards using liquid heat media | Jun 11, 19 | May 24, 22 | Greene Lyon Group, Inc. |
| 11310950 | Liquid metal infiltration rework of electronic assembly | Oct 22, 19 | Apr 19, 22 | International Business Machine Corporation |
| 11278977 | Liquid metal infiltration rework of electronic assembly | Oct 22, 19 | Mar 22, 22 | International Business Machine Corporation |
| 11259415 | Method for discharging fluid | Jan 21, 21 | Feb 22, 22 | Senju Metal Industry Co. LTD |
| 11235404 | Personalized copper block for selective solder removal | Mar 21, 20 | Feb 01, 22 | International Business Machine Corporation |
| 11179791 | Composite soldering, de-soldering station and system | Aug 08, 18 | Nov 23, 21 | Hakko Corporation |
| 11072033 | Apparatus for automatically clearing residual solder paste with a gas channel in the working platform bearing a solder paste tub | Apr 13, 18 | Jul 27, 21 | Illinois Tool Works Inc. |
| 11020811 | Solder removal from semiconductor devices | Apr 23, 19 | Jun 01, 21 | Micron Technology Inc. |
| 10679966 | Gallium liquid metal embrittlement for device rework | Nov 20, 17 | Jun 09, 20 | IBM Corporation |
| 10629564 | Removal apparatuses for semiconductor chips | Aug 23, 17 | Apr 21, 20 | Samsung Electronics Co. Ltd. |
| 10618127 | Vacuum pick-up confirmation system | Dec 13, 16 | Apr 14, 20 | Hakko Corp. |
| 10615138 | Method for producing a connecting medium on an assembly partner, method for producing a material-fit connection between an assembly partner and a metal layer, and a system for carrying out the methods | Jan 29, 16 | Apr 07, 20 | Infineon Technologies AG |
| 10576566 | Solder paste misprint cleaning | Jun 06, 16 | Mar 03, 20 | International Business Machine Corporation |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0022,838 | METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS | Oct 01, 24 | Jan 16, 25 | Not available |
| 2024/0408,701 | WELDING-PAD REPAIR DEVICE AND PAD REPAIR METHOD | Jul 24, 23 | Dec 12, 24 | BOE MLED TECHNOLOGY CO., LTD.; BOE Technology Group Co. Ltd.; |
| 2024/0321,816 | METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS | Mar 04, 24 | Sep 26, 24 | NCC Nano, LLC |
| 2024/0297,144 | METHOD AND APPARATUS FOR DEBONDING TEMPORARILY BONDED WAFERS IN WAFER-LEVEL PACKAGING APPLICATIONS | May 11, 24 | Sep 05, 24 | NCC Nano, LLC |
| 2024/0286,229 | REMOVABLE STOP-OFF MATERIAL FOR BRAZING | Feb 23, 24 | Aug 29, 24 | Not available |
| 2024/0189,932 | SMART DESOLDERING DEVICE AND METHOD FOR LASER REMOVAL OF SUBSTRATE SOLDER MASK DRIVEN BY ARTIFICIAL INTELLIGENCE | Nov 14, 23 | Jun 13, 24 | Not available |
| 2024/0165,726 | Composite Soldering, De-Soldering Station and System | Sep 08, 21 | May 23, 24 | Hakko Corporation |
| 2023/0249,273 | CONTROL ASSEMBLY FABRICATION VIA BRAZING | Mar 30, 23 | Aug 10, 23 | Not available |
| 2023/0017,361 | SOLDER CUTTING DEVICE, SOLDER CUTTING UNIT, PART MOUNTING DEVICE, AND PRODUCTION SYSTEM | Sep 23, 22 | Jan 19, 23 | HIRATA CORPORATION |
| 2022/0347,779 | HEATING DEVICE | Jul 14, 22 | Nov 03, 22 | Not available |
| 2022/0310,551 | SEMICONDUCTOR MANUFACTURING APPARATUS | Sep 29, 21 | Sep 29, 22 | Not available |
| 2022/0203,471 | PRODUCT REMOVING METHOD, FLUX REMOVING METHOD, AND PRODUCT REMOVING APPARATUS | Dec 06, 21 | Jun 30, 22 | Not available |
| 2022/0105,582 | CONTROL ASSEMBLY FABRICATION VIA BRAZING | Oct 01, 20 | Apr 07, 22 | Not available |
| 2020/0156,168 | Soldering Device, Soldering System And Method | Jul 02, 18 | May 21, 20 | ERSA GMBH |
| 2020/0061,730 | HEATING DEVICE | May 25, 18 | Feb 27, 20 | Not available |
| 2018/0233,483 | GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK | Nov 20, 17 | Aug 16, 18 | Not available |
| 2018/0161,903 | Vacuum Pick-up Confirmation System | Dec 13, 16 | Jun 14, 18 | Hakko Corporation |
| 2018/0104,758 | PREVENTING AN UNWANTED DEPOSITION OF METAL DURING a FLUX CLEAN | Oct 14, 16 | Apr 19, 18 | Not available |
| 2017/0044,903 | ROTATING COMPONENT FOR A TURBOMACHINE AND METHOD FOR PROVIDING COOLING OF A ROTATING COMPONENT | Aug 13, 15 | Feb 16, 17 | GENERAL ELECTRIC COMPANY |
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