B23K 1/012

Sub-Class

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Description

Class  B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM


Subclass 1/012: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering with the use of hot gas

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12246387 Device for shifting at least one sub-assembly between a provisioning zone and working zoneJul 27, 21Mar 11, 25WERKZEUGBAU SIEGFRIED HOFMANN GMBH
12092525 Work measurement system, education system, and quality control systemAug 28, 20Sep 17, 24Hitachi Ltd.; DAIKIN INDUSTRIES, LTD.;
11986899 Soldering apparatusNov 09, 22May 21, 24ERSA GMBH
11850672 Method of using processing ovenJul 25, 22Dec 26, 23YIELD ENGINEERING SYSTEMS, INC.
11823920 Apparatus for attaching semiconductor partsDec 16, 20Nov 21, 23JMJ KOREA CO., LTD.
11511364 Flux collection method and flux collection apparatusFeb 12, 19Nov 29, 22Panasonic Intelletual Property Management Co., Ltd.
11499313 Hollow pipe-sandwiching metal plate and applications thereofMar 24, 20Nov 15, 22Not available
11465225 Method of using processing ovenMar 11, 22Oct 11, 22YIELD ENGINEERING SYSTEMS, INC.
11456274 Method of using a processing ovenMar 04, 22Sep 27, 22YIELD ENGINEERING SYSTEMS, INC.
11311956 Soldering apparatusAug 23, 21Apr 26, 22Senju Metal Industry Co. LTD
11090751 Reflow device and method for manufacturing substrate using the reflow deviceMay 09, 19Aug 17, 21DENSO Corporation
11090768 Lead-free and antimony-free tin solder reliable at high temperaturesApr 28, 15Aug 17, 21Alpha Assembly Solutions Inc.
10974334 Soldering tool with nozzle-shaped soldering tip and a channel in the soldering tip to feed hot gasMar 25, 19Apr 13, 21FEW FAHRZEUGELEKTRIKWERK GMBH & CO. KG
10814418 Soldering apparatus and method for manufacturing electronic unitOct 27, 17Oct 27, 20DENSO Corporation
10773325 Flux-free joining of aluminium composite materialsJun 09, 16Sep 15, 20Hydro Aluminium Rolled Products GmbH
10668574 High temperature devices and applications employing pure aluminum braze for joining components of said devicesFeb 01, 18Jun 02, 20MHI Health Devices, LLC
10668571 Nanoparticle powders, methods for forming braze pastes, and methods for modifying articlesDec 14, 17Jun 02, 20General Electric Company
10563920 Oven-style nozzle for reworking operations involving bottom-side terminated components or other componentsDec 08, 14Feb 18, 20Raytheon Company
10500662 Device for feeding a stream of hot gasJun 26, 14Dec 10, 19ERSA GMBH
10486262 Method and system for joining workpiecesMay 09, 13Nov 26, 19Carrier Corporation

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0087,625 SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATIONJan 11, 24Mar 13, 25Not available
2024/0363,579 SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICEFeb 27, 24Oct 31, 24Samsung Electronics Co., Ltd.
2024/0355,640 SOLDER REFLOW APPARATUS AND METHOD OF MANUFACTURING ELECTRONIC DEVICEFeb 08, 24Oct 24, 24Not available
2024/0173,787 TOOL AND MANUFACTURING METHOD OF ITMar 30, 22May 30, 24Seco Tools AB
2018/0141,166 ALUMINUM ALLOY BRAZING SHEETJan 22, 18May 24, 18Not available
2018/0126,474 SOLDERING APPARATUS AND METHOD FOR MANUFACTURING ELECTRONIC UNITOct 27, 17May 10, 18Not available
2018/0015,558 SOLDERING APPARATUSFeb 25, 15Jan 18, 18FUJI MACHINE MFG. CO., LTD.
2015/0174,686 METHOD AND DEVICE FOR JOINING CONDUCTORS TO SUBSTRATESFeb 25, 15Jun 25, 15MASCHINENFABRIK REINHAUSEN GMBH

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Top Owners in This Subclass

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Patents Issued To Date - By Filing Year

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