Class B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
Subclass 1/005: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) Soldering by means of radiant energy
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12263525 | Joined solid production method | Jan 04, 24 | Apr 01, 25 | K.K. SUN METALON |
| 12263959 | Space-based circuit-replacing robotic system | Jun 26, 20 | Apr 01, 25 | The United States of America as represented by the Secretary of the Navy |
| 12262477 | Reprint apparatus for circuit board and reprint method using the same | Feb 17, 23 | Mar 25, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 12246378 | Metal solid production method | Jan 04, 24 | Mar 11, 25 | K.K. SUN METALON |
| 12237296 | System for laser bonding of flip chip | Nov 01, 21 | Feb 25, 25 | PROTEC CO., LTD. |
| 12224263 | Method for transferring electronic device | Mar 05, 24 | Feb 11, 25 | MICRAFT SYSTEM PLUS CO., LTD. |
| 12214436 | Laser soldering system and light shaping method thereof | Dec 08, 21 | Feb 04, 25 | Delta Electronics Inc. |
| 12179279 | Method for producing a joining connection between metal sheets | Feb 26, 21 | Dec 31, 24 | Magna International Inc. |
| 12138704 | Method for attaching parts by spraying a powder of a ductile material; corresponding assembly | Jun 25, 20 | Nov 12, 24 | LISI Automotive |
| 12115579 | Metal solid production method | Mar 15, 22 | Oct 15, 24 | K.K. SUN METALON |
| 12113331 | System and apparatus for sequential transient liquid phase bonding | Jun 16, 23 | Oct 08, 24 | AEVA, INC. |
| 12090563 | Laser reflow method | Feb 28, 23 | Sep 17, 24 | Disco Corporation |
| 12048972 | Method and device including laser heating of gripper for repairing a test contact arrangement | Jun 19, 19 | Jul 30, 24 | Pac Tech—Packaging Technologies GmbH |
| 12051887 | Method for soldering electronic component and method for manufacturing LED display | Nov 10, 22 | Jul 30, 24 | MICRAFT SYSTEM PLUS CO., LTD. |
| 11986898 | Laser brazing process | Jul 23, 20 | May 21, 24 | Ningbo Geely Automobile Research & Dev. Co., Ltd. |
| 11980960 | Solder device and system controller thereof | Mar 06, 23 | May 14, 24 | Delta Electronics Inc. |
| 11973053 | Laser bonding system and laser bonding apparatus | Apr 12, 21 | Apr 30, 24 | Samsung Electronics Co. Ltd. |
| 11973054 | Method for transferring electronic device | Jan 18, 22 | Apr 30, 24 | Stroke Precision Advanced Engineering Co., Ltd. |
| 11967576 | Systems for thermally treating conductive elements on semiconductor and wafer structures | Jul 08, 21 | Apr 23, 24 | Micron Technology Inc. |
| 11935863 | Laser reflow apparatus and laser reflow method | Dec 16, 20 | Mar 19, 24 | Disco Corporation |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0105,203 | SOLDERING APPARATUS, METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE USING THE SAME, AND METHOD FOR MANUFACTURING SOLDERING APPARATUS | May 21, 24 | Mar 27, 25 | Not available |
| 2025/0069,901 | METHOD FOR MANUFACTURING PACKAGE STRUCTURE | Aug 25, 23 | Feb 27, 25 | Advanced Semiconductor Engineering, Inc. |
| 2025/0033,130 | LASER SOLDERING DEVICE WITH ADJUSTABLE LASER IRRADIATION POSITION AND SOLDERING METHOD COMPRISING SAME | Sep 20, 22 | Jan 30, 25 | LASERVALL TECHNOLOGY CO., LTD |
| 2025/0033,142 | LASER PROCESSING APPARATUS METHOD INCLUDING SAME AND PROCESSED OBJECT PROCESSED THEREBY | Sep 28, 22 | Jan 30, 25 | LASERVALL TECHNOLOGY CO., LTD |
| 2025/0031,480 | TABBING DEVICE FOR MANUFACTURING SOLAR CELL MODULE PREVENTING OVERSOLDERING | Jul 06, 22 | Jan 23, 25 | HANWHA SOLUTIONS CORPORATION |
| 2025/0018,473 | METAL SOLID PRODUCTION METHOD | Sep 27, 24 | Jan 16, 25 | Not available |
| 2025/0001,511 | ELECTRON BEAM BRAZING TO REPAIR COMPONENT | Jun 28, 23 | Jan 02, 25 | Not available |
| 2024/0408,686 | METHOD FOR BRAZE FILLER METAL PREPARATION | Jun 08, 23 | Dec 12, 24 | Not available |
| 2024/0408,687 | SOLDER SOLDERING METHOD USING LASER | Mar 27, 24 | Dec 12, 24 | S.S.P. Inc. |
| 2024/0371,663 | TEMPORARY CARRYING SUBSTRATE, CHIP TRANSFERRING DEVICE AND CHIP TRANSFERRING METHOD | Mar 27, 24 | Nov 07, 24 | Not available |
| 2024/0365,475 | REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAME | Jul 12, 24 | Oct 31, 24 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 2024/0293,893 | SOLDERING APPARATUS AND SOLDERING METHOD USING SAME | Apr 26, 22 | Sep 05, 24 | HCP TECHNOLOGY CO., LTD. |
| 2024/0269,759 | CIRCUIT BOARD ASSEMBLY SOLDERING APPARATUS AND CIRCUIT BOARD ASSEMBLY SOLDERING METHOD | Sep 14, 22 | Aug 15, 24 | Honor Device Co., Ltd. |
| 2024/0253,142 | LASER SOLDERING APPARATUS, CONTROL APPARATUS, AND LASER SOLDERING METHOD | Feb 17, 22 | Aug 01, 24 | Not available |
| 2024/0246,162 | RADIANT CURTAIN HEATING ASSEMBLY FOR WAVE SOLDERING MACHINE | Jan 20, 23 | Jul 25, 24 | Not available |
| 2024/0250,336 | COOLING STRUCTURE, BATTERY UNIT, AND MANUFACTURING METHOD OF COOLING STRUCTURE | Apr 15, 22 | Jul 25, 24 | 501 Nippon Steel Corporation |
| 2024/0222,302 | REPAIR OF SOLDER BUMPS | Jul 19, 21 | Jul 04, 24 | Not available |
| 2024/0170,422 | Die-Beam Alignment for Laser-Assisted Bonding | Jan 31, 24 | May 23, 24 | STATS ChipPAC Pte. Ltd. |
| 2024/0157,457 | PROCESS FOR HIGH DENSITY SOLDER INTERCONNECT | Nov 09, 23 | May 16, 24 | Not available |
| 2024/0145,618 | PHOTOVOLTAIC MODULE AND MANUFACTURING METHOD THEREOF | Dec 05, 23 | May 02, 24 | SHANGHAI JINKO GREEN ENERGY ENTERPRISE MANAGEMENT CO., LTD.; ZHEJIANG JINKO SOLAR CO., LTD.; |
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