Class B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
Subclass 1/00: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34)
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12263959 | Space-based circuit-replacing robotic system | Jun 26, 20 | Apr 01, 25 | The United States of America as represented by the Secretary of the Navy |
| 12262477 | Reprint apparatus for circuit board and reprint method using the same | Feb 17, 23 | Mar 25, 25 | SAMSUNG-ELECTRO-MECHANICS CO. LTD. |
| 12262480 | Coating device and component mounting machine | Jul 17, 20 | Mar 25, 25 | FUJI CORPORATION |
| 12251769 | Closed socket brazed joint assembly | Jul 15, 22 | Mar 18, 25 | TRANSPORTATION IP HOLDINGS, LLC |
| 12251923 | Joined body, holding device, and electrostatic chuck | Jun 25, 21 | Mar 18, 25 | NITERRA CO., LTD. |
| 12255062 | Integrate rinse module in hybrid bonding platform | Nov 14, 23 | Mar 18, 25 | Taiwan Semiconductor Manufacturing Company, Ltd. |
| 12246376 | Sinter-ready silver films | May 05, 20 | Mar 11, 25 | Alpha Assembly Solutions Inc. |
| 12246398 | Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump | Dec 15, 20 | Mar 11, 25 | Resonac Corporation |
| 12250778 | Circuit board manufacturing method and circuit board manufacturing device | Jun 18, 19 | Mar 11, 25 | FUJI CORPORATION |
| 12241582 | Vacuum adiabatic body | Nov 01, 21 | Mar 04, 25 | LG Electronics Inc. |
| 12243802 | Methods and heat distribution devices for thermal management of chip assemblies | Apr 12, 24 | Mar 04, 25 | Google LLC |
| 12233470 | Device and method for thermal joining, in particular for thermal joining of a heat exchanger for a motor vehicle | Apr 26, 19 | Feb 25, 25 | HANON SYSTEMS |
| 12237297 | Solder reflow apparatus and method of manufacturing an electronic device | Mar 28, 23 | Feb 25, 25 | Samsung Electronics Co. Ltd. |
| 12226856 | Solder material, method for producing a solder material of this type and use of a solder material of this type in order to connect a metal layer to a ceramic layer | Dec 03, 20 | Feb 18, 25 | Rogers Germany GmbH |
| 12224263 | Method for transferring electronic device | Mar 05, 24 | Feb 11, 25 | MICRAFT SYSTEM PLUS CO., LTD. |
| 12214447 | Synchronous motion selective soldering apparatus and method | Nov 27, 18 | Feb 04, 25 | Nordson Corporation |
| 12209819 | Conformal heat exchanger | Jun 03, 22 | Jan 28, 25 | RTX CORPORATION |
| 12201453 | Microneedle fabrication and device implantation | Dec 21, 23 | Jan 21, 25 | The Regents of the University of California |
| 12202068 | Preparation of composite rods | Feb 25, 22 | Jan 21, 25 | CUTTING & WEAR RESISTANT DEVELOPMENTS LIMITED |
| 12202077 | Transport system for transporting soldering material through a soldering apparatus, and a soldering apparatus | Nov 09, 22 | Jan 21, 25 | ERSA GMBH |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0114,878 | BRAZE ALLOYS | May 16, 24 | Apr 10, 25 | Not available |
| 2025/0112,060 | Robotic Cover Sealer | Apr 01, 24 | Apr 03, 25 | MicroCircuit Laboratories, LLC |
| 2025/0113,439 | CERAMIC SUBSTRATE, CERAMIC CIRCUIT BOARD, SEMICONDUCTOR DEVICE, METHOD FOR MANUFACTURING CERAMIC SUBSTRATE, AND METHOD FOR MANUFACTURING CERAMIC SPLIT SUBSTRATE | Nov 25, 24 | Apr 03, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0089,786 | CARTRIDGE FOR AN AEROSOL-GENERATING SYSTEM | Dec 05, 24 | Mar 20, 25 | ALTRIA CLIENT SERVICES LLC |
| 2025/0090,669 | PHARMACEUTICAL SYRUP FORMULATION OR SUSPENSION | Nov 25, 24 | Mar 20, 25 | Not available |
| 2025/0091,147 | METHODS FOR JOINING COMPONENTS AT NARROW, UNIFORM BRAZE JOINTS | Sep 15, 23 | Mar 20, 25 | Not available |
| 2025/0083,243 | REVERSE SOLDERING CONNECTION STRUCTURE OF MICRONEEDLE AND WIRING AND PREPARATION PROCESS THEREFOR | Nov 21, 24 | Mar 13, 25 | WUHAN NEURACOM TECHNOLOGY DEVELOPMENT CO., LTD. |
| 2025/0083,244 | METHOD OF BRAZE REPAIR FOR EUTECTIC PHASE REDUCTION | Sep 09, 24 | Mar 13, 25 | Not available |
| 2025/0087,625 | SEMICONDUCTOR PROCESSING TOOL AND METHODS OF OPERATION | Jan 11, 24 | Mar 13, 25 | Not available |
| 2025/0073,799 | IMPROVED METHOD AND ARRANGEMENT FOR A MARTENSITE-FREE BRAZING PROCESS | Apr 06, 22 | Mar 06, 25 | Safetrack Infrasystems Sisab AB |
| 2025/0073,800 | METHOD FOR REPAIRING WIDE CRACK IN HOT GAS PATH PART FOR GAS TURBINE USING BRAZING | Jul 19, 24 | Mar 06, 25 | Not available |
| 2025/0073,826 | METHOD FOR PRODUCING ACTIVE METAL PASTE, METHOD FOR PRODUCING CERAMIC CIRCUIT BOARD, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, ACTIVE METAL PASTE, CERAMIC CIRCUIT BOARD, AND SEMICONDUCTOR DEVICE | Nov 20, 24 | Mar 06, 25 | KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.; |
| 2025/0065,429 | MOUNTING SYSTEM AND MEMBER REPLENISHMENT GUIDANCE METHOD | Jan 26, 22 | Feb 27, 25 | FUJI CORPORATION |
| 2025/0069,901 | METHOD FOR MANUFACTURING PACKAGE STRUCTURE | Aug 25, 23 | Feb 27, 25 | Advanced Semiconductor Engineering, Inc. |
| 2025/0071,910 | COMPONENT-ATTACHED FPC MANUFACTURING METHOD | Aug 15, 24 | Feb 27, 25 | Yazaki Corporation |
| 2025/0058,392 | BRAZED HYBRID ALUMINUM/COPPER HEAT EXCHANGERS | Aug 15, 23 | Feb 20, 25 | Not available |
| 2025/0050,439 | SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT NICKEL ALLOY JOINTS AND METHODS FOR MAKING SAME | Oct 29, 24 | Feb 13, 25 | Watlow Electric Manufacturing Company |
| 2025/0050,440 | METHOD OF CLEANING A BOTTOM PLATE | Jul 18, 24 | Feb 13, 25 | Not available |
| 2025/0056,735 | Solder Mask Arrangement for a Component Carrier | Oct 31, 24 | Feb 13, 25 | Not available |
| 2025/0041,958 | SELF CORRECTING WAVE SOLDERING MACHINE | Dec 07, 22 | Feb 06, 25 | Not available |
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