H01L 21/203

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Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/203: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising elements of the fourth group of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials Deposition of semiconductor materials on a substrate, e.g. epitaxial growth using physical deposition, e.g. vacuum deposition, sputtering

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
11795549 Metal plate for deposition mask, and deposition mask and manufacturing method thereforMar 07, 22Oct 24, 23LG INNOTEK CO., LTD.
11732364 Metal plate for deposition mask, and deposition mask and manufacturing method thereforJan 12, 22Aug 22, 23LG INNOTEK CO., LTD.
11728414 Semiconductor device including a Fin-FET and method of manufacturing the sameFeb 14, 22Aug 15, 23TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
11703643 Integrated photonics including waveguiding materialDec 17, 19Jul 18, 23The Research Foundation for the State University of New York
11685990 Textured processing chamber components and methods of manufacturing sameDec 08, 17Jun 27, 23APPLIED MATERIALS, INC.
11549172 Compound semiconductor, method for manufacturing same, and nitride semiconductorNov 02, 20Jan 10, 23Japan Science and Technology Agency
11515127 End effectors for moving workpieces and replaceable parts within a system for processing workpieces under vacuumMay 13, 20Nov 29, 22BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD; MATTSON TECHNOLOGY, INC.;
11508617 Method of forming interconnect for semiconductor deviceOct 24, 19Nov 22, 22Applied Materials Inc.
11508560 Focus ring adjustment assembly of a system for processing workpieces under vacuumMay 13, 20Nov 22, 22BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD; MATTSON TECHNOLOGY, INC.;
11492696 Manufacturing method for semiconductor laminated film, and semiconductor laminated filmJul 12, 17Nov 08, 22NATIONAL UNIVERSITY CORPORATION TOKYO UNIVERSITY OF AGRICULUTRE AND TECHNOLOGY; National Institute of Information and Communications Technology;
11437488 Split-gate MOSFET with gate shieldNov 24, 20Sep 06, 22Applied Materials Inc.
11430659 Light-emitting device, method for manufacturing the same, and projectorAug 03, 18Aug 30, 22Seiko Epson Corporation; Sophia School Corporation;
11414747 Sputtering deviceJun 19, 19Aug 16, 22Tokyo Electron Limited
11404255 Sputtering method and sputtering apparatusSep 09, 20Aug 02, 22Tokyo Electron Limited
11393686 Semiconductor device having a planar III-N semiconductor layer and fabrication methodOct 05, 18Jul 19, 22HEXAGEM AB
11373910 Semiconductor device including a Fin-FET and method of manufacturing the sameJun 09, 20Jun 28, 22Taiwan Semiconductor Manufacturing Co., Ltd.
11348767 Plasma processing apparatus having a focus ring adjustment assemblyMay 13, 20May 31, 22BEIJING E-TOWN SEMICONDUCTOR TECHNOLOGY, CO., LTD; MATTSON TECHNOLOGY, INC.;
11342466 Amorphous oxide semiconductor film, oxide sintered body, thin film transistor, sputtering target, electronic device, and amorphous oxide semiconductor film production methodJan 31, 18May 24, 22Idemitsu Kosan Co. Ltd.
11335854 Metal plate for deposition mask, and deposition mask and manufacturing method thereforMar 27, 20May 17, 22LG INNOTEK CO., LTD.
11251087 Semiconductor device including a Fin-FET and method of manufacturing the sameJun 09, 20Feb 15, 22Taiwan Semiconductor Manufacturing Co., Ltd.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2021/0325,337 METHOD OF FORMING ION SENSORSAug 16, 19Oct 21, 21Life Technologies Corporation
2021/0082,675 SPUTTERING METHOD AND SPUTTERING APPARATUSSep 09, 20Mar 18, 21Not available
2021/0043,457 LIGHT-EMITTING DEVICE, METHOD FOR MANUFACTURING THE SAME, AND PROJECTORAug 03, 18Feb 11, 21Not available
2021/0028,018 PRESSURIZING DEVICE AND PRESSURIZING METHODSep 17, 20Jan 28, 21NIKKISO CO., LTD.
2020/0350,188 INLINE VACUUM PROCESSING SYSTEM WITH SUBSTRATE AND CARRIER COOLINGApr 29, 20Nov 05, 20Not available
2020/0227,273 HARD MASK AND SEMICONDUCTOR DEVICE MANUFACTURING METHODJan 15, 20Jul 16, 20Not available
2019/0194,796 COMPOUND SEMICONDUCTOR, METHOD FOR MANUFACTURING SAME, AND NITRIDE SEMICONDUCTORJun 01, 17Jun 27, 19Not available

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Patents Issued To Date - By Filing Year

Average Time to Issuance