H01L 21/108

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Class  H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR


Subclass 21/108: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer the devices having semiconductor bodies comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials Preliminary treatment of the selenium or tellurium, its application to the foundation plate, or the subsequent treatment of the combination Provision of discrete insulating layers, i.e. non-genetic barrier layers

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
11508614 Method of forming semiconductor device having capped air gaps between buried bit lines and buried gateOct 28, 20Nov 22, 22United Microelectronics Corp.; Fujian Jinhua Integrated Circuit Co., Ltd.;
11349003 Transistor structure with a stress layerMay 14, 20May 31, 22Cambridge Electronics, Inc.
10943907 Integrated circuitry comprising an array, method of forming an array, method of forming DRAM circuitry, and method used in the fabrication of integrated circuitryMay 07, 20Mar 09, 21Micron Technology Inc.
10916429 Semiconductor device packages and stacked package assemblies including high density interconnectionsDec 05, 19Feb 09, 21Advanced Semiconductor Engineering Inc.
10535521 Semiconductor device packages and stacked package assemblies including high density interconnectionsMar 08, 19Jan 14, 20Advanced Semiconductor Engineering Inc.
10515806 Semiconductor device packages and stacked package assemblies including high density interconnectionsMar 08, 19Dec 24, 19Advanced Semiconductor Engineering Inc.
10276382 Semiconductor device packages and stacked package assemblies including high density interconnectionsJun 06, 17Apr 30, 19Advanced Semiconductor Engineering Inc.
9978757 Semiconductor deviceAug 27, 15May 22, 18Semiconductor Energy Laboratory Co., Ltd.
9035458 Low resistance stacked annular contactJan 20, 14May 19, 15TEXAS INSTRUMENTS INCORPORATED
8890225 Structure and method for single gate non-volatile memory device having a capacitor well doping design with improved coupling efficiencyOct 14, 11Nov 18, 14TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8841746 On-die programming of integrated circuit bond padsFeb 26, 13Sep 23, 14AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
8652855 Low resistance stacked annular contactMar 29, 12Feb 18, 14TEXAS INSTRUMENTS INCORPORATED, MIDWEST COMMUNITY DEVELOPMENT FUND IV, LLC,
8492194 Chemical mechanical polishing stop layer for fully amorphous phase change memory pore cellMay 06, 11Jul 23, 13GLOBALFOUNDRIES INC.
8237209 Capacitors integrated with metal gate formationAug 23, 11Aug 07, 12TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8159013 Semiconductor integrated circuit device having a dummy metal wiring lineFeb 24, 09Apr 17, 12SOCIONEXT INC.
8076235 Semiconductor device and fabrication method thereofOct 27, 10Dec 13, 11TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
8012790 Chemical mechanical polishing stop layer for fully amorphous phase change memory pore cellAug 28, 09Sep 06, 11GLOBALFOUNDRIES INC.
7985995 filmsAug 03, 06Jul 26, 11MICRON TECHNOLOGY, INC.
7846832 Semiconductor device and fabrication method thereofJul 07, 05Dec 07, 10TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
7618874 Methods of forming capacitorsMay 02, 08Nov 17, 09MICRON TECHNOLOGY, INC.

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2020/0111,671 SEMICONDUCTOR DEVICE PACKAGES AND STACKED PACKAGE ASSEMBLIES INCLUDING HIGH DENSITY INTERCONNECTIONSDec 05, 19Apr 09, 20Advanced Semiconductor Engineering, Inc.

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