Class H01L : SEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
Subclass 21/027: Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof Manufacture or treatment of semiconductor devices or of parts thereof Making masks on semiconductor bodies for further photolithographic processing, not provided for in group H01L 21/18 or H01L 21/34
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12265324 | Agglutinant for pellicle, pellicle, exposure original plate with pellicle, method for producing semiconductor device, method for producing liquid crystal display board, method for regenerating exposure original plate, and peeling residue reduction method | Apr 15, 20 | Apr 01, 25 | Shin-Etsu Chemical Co. Ltd. |
| 12265326 | Method for reducing lithography defects and pattern transfer | Apr 20, 22 | Apr 01, 25 | Tokyo Electron Limited |
| 12265328 | Photoactive, inorganic ligand-capped inorganic nanocrystals | Jun 12, 23 | Apr 01, 25 | The Argonne National Laboratory The University of Chicago Development |
| 12265332 | Method of manufacturing a semiconductor device | Oct 01, 21 | Apr 01, 25 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 12266527 | Directed self-assembly enabled patterning over metal layers using assisting features | Dec 22, 21 | Apr 01, 25 | Intel Corp. |
| 12266539 | Method of manufacturing semiconductor devices | Jul 24, 23 | Apr 01, 25 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 12259647 | Method of manufacturing extreme ultraviolet (EUV) photomask and method and apparatus for correcting EUV photomask | Jul 09, 21 | Mar 25, 25 | Samsung Electronics Co. Ltd. |
| 12259654 | Method for manufacturing semiconductor device | Jan 12, 21 | Mar 25, 25 | Sumitomo Electric Industries Ltd. |
| 12259663 | Template, method for fabricating template, and method for fabricating semiconductor device | Aug 11, 21 | Mar 25, 25 | Kioxia Corporation |
| 12261049 | Selective etch of a substrate | Jun 09, 22 | Mar 25, 25 | Applied Materials Inc. |
| 12261122 | Contact over active gate structures with etch stop layers for advanced integrated circuit structure fabrication | Sep 19, 23 | Mar 25, 25 | Intel Corp. |
| 12261213 | Fin-end gate structures and method forming same | Jul 25, 22 | Mar 25, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12262539 | 3D NAND memory device and method of forming the same | Nov 13, 23 | Mar 25, 25 | Yangtze Memory Technologies Co., Ltd. |
| 12253801 | Solution, solution storage body, actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and manufacturing method of semiconductor device | Feb 12, 19 | Mar 18, 25 | FUJIFILM Corporation |
| 12248252 | Bubble defect reduction | Nov 15, 19 | Mar 11, 25 | Lam Research Corporation |
| 12249507 | Method of manufacturing a semiconductor device | Aug 10, 22 | Mar 11, 25 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 12249508 | Selective patterning with wet-dry bilayer resist | May 03, 22 | Mar 11, 25 | Tokyo Electron Limited |
| 12242196 | Resist underlayer film-forming composition containing indolocarbazole novolak resin | Jun 09, 23 | Mar 04, 25 | Nissan Chemical Industries Ltd. |
| 12242197 | Apparatus, system and method | Mar 02, 20 | Mar 04, 25 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12242199 | Method of using wafer stage | Aug 10, 23 | Mar 04, 25 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0116,923 | RESIST COMPOSITION FOR PHOTOLITHOGRAPHY AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICES USING THE SAME | Sep 16, 24 | Apr 10, 25 | Inha University Research and Business Foundation |
| 2025/0116,936 | PHOTOCURABLE RESIN COMPOSITION CONTAINING SELF-CROSSLINKABLE POLYMER | Feb 21, 23 | Apr 10, 25 | Nissan Chemical Corporation |
| 2025/0116,937 | LITHOGRAPHY PROCESS | Oct 04, 23 | Apr 10, 25 | TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. |
| 2025/0118,555 | SELECTIVE PASSIVATION OF PHOTORESISTS | Oct 10, 23 | Apr 10, 25 | Not available |
| 2025/0118,556 | METHOD FOR FORMING DEPOSITION FILM | Oct 07, 22 | Apr 10, 25 | Resonac Corporation |
| 2025/0118,557 | SELECTIVE HARDMASK ETCH FOR SEMICONDUCTOR PROCESSING | Oct 05, 23 | Apr 10, 25 | Applied Materials Inc. |
| 2025/0115,691 | METHOD OF FORMING PATTERNS | Dec 16, 24 | Apr 10, 25 | Not available |
| 2025/0120,157 | SEMICONDUCTOR DEVICE WITH SLANTED FIELD PLATE | Mar 19, 24 | Apr 10, 25 | Not available |
| 2025/0112,044 | MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE | Dec 12, 24 | Apr 03, 25 | Not available |
| 2025/0112,045 | DRY DEVELOPMENT OF RESISTS | Dec 13, 24 | Apr 03, 25 | Lam Research Corporation |
| 2025/0109,242 | COMPOSITION FOR FORMING RESIST UNDERLAYER FILM CONTAINING HYDROXYCINNAMIC ACID DERIVATIVE | Oct 17, 22 | Apr 03, 25 | Nissan Chemical Corporation |
| 2025/0110,402 | SILICON-CONTAINING RESIST UNDERLAYER FILM-FORMING COMPOSITION HAVING UNSATURATED BOND AND CYCLIC STRUCTURE | Feb 17, 23 | Apr 03, 25 | Nissan Chemical Corporation |
| 2025/0110,407 | SEMICONDUCTOR SUBSTRATE MANUFACTURING METHOD, AND RESIST BASE FILM FORMING COMPOSITION | Oct 09, 24 | Apr 03, 25 | JSR Corporation |
| 2025/0102,907 | SEMICONDUCTOR PHOTORESIST COMPOSITION AND METHOD OF FORMING PATTERNS USING THE COMPOSITION | May 28, 24 | Mar 27, 25 | Not available |
| 2025/0102,909 | TIN COMPOUNDS CONTAINING A TIN-OXYGEN DOUBLE BOND, A PHOTORESIST COMPOSITION CONTAINING THE SAME AND A METHOD OF FORMING A PHOTORESIST PATTERN USING THE SAME | Sep 20, 24 | Mar 27, 25 | INDUSTRY FOUNDATION OF CHONNAM NATIONAL UNIVERSITY |
| 2025/0102,913 | RESIST COMPOSITION, RESIST PATTERN FORMATION METHOD, AND COMPOUND | Jan 17, 23 | Mar 27, 25 | Not available |
| 2025/0102,914 | PHOTORESIST COMPOSITIONS INCLUDING A SULFONATE GROUP AND METHODS OF MANUFACTURING INTEGRATED CIRCUIT DEVICES USING THE SAME | Apr 18, 24 | Mar 27, 25 | Not available |
| 2025/0102,916 | Photoresist and Method | Dec 09, 24 | Mar 27, 25 | Not available |
| 2025/0102,918 | SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD | Apr 26, 22 | Mar 27, 25 | Not available |
| 2025/0102,922 | Exposure method of semiconductor pattern | Oct 22, 23 | Mar 27, 25 | United Microelectronics Corp. |
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