|
9,116,145
|
Flexible IC/microfluidic integration and packaging |
Dec 14, 12 |
Aug 25, 15 |
THE GEORGE WASHINGTON UNIVERSITY, THE GEORGE WASHINGTON UNIVERSITY |
|
9,119,334
|
Method for manufacturing circuit board having holes to increase resonant frequency of via stubs |
May 16, 13 |
Aug 25, 15 |
LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD., LENOVO ENTERPRISE SOLUTIONS (SINGAPORE) PTE. LTD. |
|
9,113,547
|
Same layer microelectronic circuit patterning using hybrid laser projection patterning (LPP) and semi-additive patterning(SAP) |
Oct 24, 08 |
Aug 18, 15 |
INTEL CORPORATION, INTEL CORP. |
|
9,105,764
|
Light emitting device and projector |
May 08, 14 |
Aug 11, 15 |
SEIKO EPSON CORPORATION, SEIKO EPSON CORPORATION |
|
9,107,314
|
Method of manufacturing a wiring board having via structures |
Mar 13, 13 |
Aug 11, 15 |
FUJITSU LIMITED, FUJITSU LIMITED |
