Class G11C : STATIC STORES
Subclass 7/18: Arrangements for writing information into, or reading information out from, a digital store (G11C 5/00 takes precedence; auxiliary circuits for stores using semiconductor devices G11C 11/4063, G11C 11/413, G11C 11/4193) Bit line organisation; Bit line lay-out
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12260130 | Memory device for computing in-memory | Jan 31, 23 | Mar 25, 25 | Macronix International Co. Ltd. |
| 12261111 | Memory devices and related methods of forming a memory device | Mar 08, 24 | Mar 25, 25 | Micron Technology Inc. |
| 12249399 | On-die termination of address and command signals | May 31, 24 | Mar 11, 25 | RAMBUS INC. |
| 12243620 | Electronic devices comprising air gaps adjacent to bitlines | Nov 08, 22 | Mar 04, 25 | Micron Technology Inc. |
| 12238926 | Three-dimensional memory device and method | Jan 03, 23 | Feb 25, 25 | Taiwan Semiconductor Manufacturing Co., Ltd. |
| 12211544 | Semiconductor memory device having memory chip bonded to a CMOS chip including a peripheral circuit | Aug 29, 23 | Jan 28, 25 | Kioxia Corporation |
| 12200927 | Memory device including reference bit line for increasing read operation accuracy | Jan 14, 22 | Jan 14, 25 | SUNRISE MEMORY CORPORATION |
| 12200936 | 3D semiconductor memory device and method of fabricating same | Oct 23, 23 | Jan 14, 25 | Samsung Electronics Co., Ltd. |
| 12187015 | Polyvinylidene fluoride-acrylate and thermoplastic polyurethane multilayer protective film | Aug 21, 23 | Jan 07, 25 | DelStar Technologies, Inc.; Mativ Luxembourg; |
| 12185538 | Semiconductor memory device with a three-dimensional stacked memory cell structure | Aug 10, 21 | Dec 31, 24 | Kioxia Corporation |
| 12176021 | Volatile memory device | Jul 28, 22 | Dec 24, 24 | Samsung Electronics Co., Ltd. |
| 12178053 | Memory device and method of forming the same | Jan 04, 24 | Dec 24, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12171097 | Semiconductor devices and electronic systems including the same | Jul 08, 21 | Dec 17, 24 | Samsung Electronics Co., Ltd. |
| 12165738 | SRAM non-clamping write driver with write assist | Dec 21, 22 | Dec 10, 24 | Synopsys Inc. |
| 12150314 | Magnetoresistive random access memory | Nov 17, 23 | Nov 19, 24 | United Microelectronics Corp. |
| 12131774 | Vertical memory device with a double word line structure | Oct 18, 22 | Oct 29, 24 | SK Hynix Inc. |
| 12120881 | Three-dimensional semiconductor devices | Jul 17, 20 | Oct 15, 24 | Samsung Electronics Co. Ltd. |
| 12112794 | Memory device having variable impedance memory cells and time-to-transition sensing of data stored therein | Apr 08, 23 | Oct 08, 24 | R&D 3 LLC |
| 12112829 | Memory array circuits, memory structures, and methods for fabricating a memory array circuit | Jan 13, 22 | Oct 08, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 12113018 | Semiconductor device | Mar 29, 23 | Oct 08, 24 | SK HYNIX INC. |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2025/0118,358 | APPARATUSES AND METHODS FOR SINGLE AND MULTI MEMORY CELL ARCHITECTURES | Jun 18, 24 | Apr 10, 25 | Micron Technology Inc. |
| 2025/0098,166 | SEMICONDUCTOR MEMORY DEVICE WITH A THREE-DIMENSIONAL STACKED MEMORY CELL STRUCTURE | Nov 29, 24 | Mar 20, 25 | Kioxia Corporation |
| 2025/0098,170 | SEMICONDUCTOR DEVICES AND ELECTRONIC SYSTEMS INCLUDING THE SAME | Dec 04, 24 | Mar 20, 25 | Not available |
| 2025/0069,630 | SEMICONDUCTOR DEVICE | Dec 19, 23 | Feb 27, 25 | Not available |
| 2025/0063,740 | MEMORY DEVICE AND METHOD OF FORMING THE SAME | Oct 24, 24 | Feb 20, 25 | Not available |
| 2025/0037,758 | VERTICAL MEMORY DEVICE WITH A DOUBLE WORD LINE STRUCTURE | Oct 10, 24 | Jan 30, 25 | Not available |
| 2025/0040,148 | MAGNETORESISTIVE RANDOM ACCESS MEMORY | Oct 16, 24 | Jan 30, 25 | United Microelectronics Corp. |
| 2025/0014,615 | MEMORY DEVICE AND SEMICONDUCTOR DEVICE | Jul 10, 24 | Jan 09, 25 | Not available |
| 2024/0429,163 | SEMICONDUCTOR DEVICE | Sep 04, 24 | Dec 26, 24 | Not available |
| 2024/0395,293 | CONTENTION-FREE DUAL-VOLTAGE LOGIC CELL | May 25, 23 | Nov 28, 24 | NVIDIA Corp. |
| 2024/0397,719 | SEMICONDUCTOR MEMORY DEVICES AND METHODS FOR FABRICATING THE SAME | Aug 01, 24 | Nov 28, 24 | Not available |
| 2024/0386,925 | MEMORY ARRAY CIRCUITS, MEMORY STRUCTURES, AND METHODS FOR FABRICATING A MEMORY ARRAY CIRCUIT | Jul 30, 24 | Nov 21, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2024/0379,161 | SEMICONDUCTOR MEMORY DEVICES WITH WRAPPED WORD LINES | Jul 25, 24 | Nov 14, 24 | Taiwan Semiconductor Manufacturing Company Ltd. |
| 2024/0373,638 | SEMICONDUCTOR MEMORY DEVICE AND A MANUFACTURING METHOD OF THE SEMICONDUCTOR MEMORY DEVICE | Jul 19, 24 | Nov 07, 24 | SK HYNIX INC. |
| 2024/0363,616 | MEMORY ARRAY CIRCUIT AND METHOD OF MANUFACTURING SAME | Jul 10, 24 | Oct 31, 24 | Not available |
| 2024/0341,099 | THREE-DIMENSIONAL (3D) SEMICONDUCTOR MEMORY DEVICE | Jun 21, 24 | Oct 10, 24 | Not available |
| 2024/0331,740 | USING EMBEDDED SWITCHES FOR REDUCING CAPACITIVE LOADING ON A MEMORY SYSTEM | Mar 12, 24 | Oct 03, 24 | Taiwan Semiconductor Manufacturing Company Limited |
| 2024/0312,830 | THREE-DIMENSIONAL MEMORY DEVICE AND METHOD | May 24, 24 | Sep 19, 24 | Not available |
| 2024/0304,265 | Masking Techniques for Memory Applications | Jul 07, 23 | Sep 12, 24 | Not available |
| 2024/0265,985 | SEMICONDUCTOR MEMORY STRUCTURE | Mar 22, 24 | Aug 08, 24 | Not available |
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