B81C

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Description

PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICRO-STRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J 13/02; processes or apparatus specially adapted for the manufacture or treatment of piezo-electric, electrostrictive or magnetostrictive elements per se H01L 41/22)

Subclasses

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Subclass Title
1/00 Manufacture or treatment of devices or systems in or on a substrate (B81C 3/00 takes precedence)
3/00 Assembling of devices or systems from individually processed components
99/00 Subject matter not provided for in other groups of this subclass

Recent Patents

Not Available
Patent #TitleFiling DateIssue DatePatent Owner
9,120,098 Fluid handling device and fluid handling system Mar 12, 12 Sep 01, 15 ENPLAS CORPORATION, ENPLAS CORPORATION
9,120,298 Method of continuously manufacturing microfluidic chips with BoPET film for a microfluidic device and microfluidic chips with BoPET film Sep 16, 13 Sep 01, 15 FLUXERGY, LLC, FLUXERGY, LLC
9,120,670 System and method for extruding parts having microstructures Feb 24, 12 Sep 01, 15 HOOWAKI, LLC, HOOWAKI, LLC
9,120,947 Surface treatments for alignment of block copolymers Mar 17, 11 Sep 01, 15 BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM, BOARD OF REGENTS, THE UNIVERSITY OF TEXAS SYSTEM
9,122,047 Preventing glass particle injection during the oil fill process Dec 31, 12 Sep 01, 15 PIXTRONIX, INC., PIXTRONIX, INC.
9,123,547 Stacked semiconductor device and method of forming the same Jun 12, 13 Sep 01, 15 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
9,123,716 Method for bonding two silicon substrates, and a correspondeing system of two silicon substrates Dec 19, 12 Sep 01, 15 ROBERT BOSCH GMBH, 502 ROBERT BOSCH GMBH
9,123,832 Fabricating method of nano structure for antireflection and fabricating method of photo device integrated with antireflection nano structure Nov 30, 10 Sep 01, 15 GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY, GWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY
9,114,977 MEMS device and process for RF and low resistance applications Nov 28, 12 Aug 25, 15 INVENSENSE, INC., INVENSENSE, INC.
9,114,978 Method for manufacturing a component having an electrical through-connection Jun 19, 13 Aug 25, 15 ROBERT BOSCH GMBH, 502 ROBERT BOSCH GMBH
9,116,145 Flexible IC/microfluidic integration and packaging Dec 14, 12 Aug 25, 15 THE GEORGE WASHINGTON UNIVERSITY, THE GEORGE WASHINGTON UNIVERSITY
9,117,934 Electromechanical devices and methods for fabrication of the same May 31, 11 Aug 25, 15 THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK, COLUMBIA UNIVERSITY/THE TRUSTEES OF COLUMBIA UNIVERSITY IN THE CITY OF NEW YORK
9,108,840 MEMS microphone and method for packaging the same Dec 30, 10 Aug 18, 15 GOERTEK, INC., GOERTEK INC.
9,108,841 Microelectronic packages having stacked accelerometer and magnetometer die and methods for the production thereof Mar 05, 14 Aug 18, 15 FREESCALE SEMICONDUCTOR, INC., FREESCALE SEMICONDUCTOR INC.
9,108,842 Reducing microelectromechanical systems stiction by formation of a silicon carbide layer Jul 19, 13 Aug 18, 15 FREESCALE SEMICONDUCTOR, INC., FREESCALE SEMICONDUCTOR, INC.
9,108,880 Nanostructured superhydrophobic, superoleophobic and/or superomniphobic coatings, methods for fabrication, and applications thereof Aug 18, 09 Aug 18, 15 THE REGENTS OF THE UNIVERSITY OF CALIFORNIA, THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
9,110,017 Apparatuses and methods for manipulating droplets Nov 11, 14 Aug 18, 15 DUKE UNIVERSITY, DUKE UNIVERSITY
9,111,787 Arrangement of two substrates having an SLID bond and method for producing such an arrangement Oct 19, 09 Aug 18, 15 ROBERT BOSCH GMBH, ROBERT BOSCH GMBH
9,112,001 Package systems and manufacturing methods thereof Feb 05, 14 Aug 18, 15 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
9,102,084 Solar cell with high aspect ratio gridlines supported between co-extruded support structures Jun 18, 10 Aug 11, 15 SOLARWORLD INNOVATIONS GMBH, SOLARWORLD INNOVATIONS GMBH

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Recent Publications

Not Available
Publication #TitleFiling DatePub DatePatent Owner
2015/0246,808 ROTARY NANOTUBE BEARING STRUCTURE AND METHODS FOR MANUFACTURING AND USING THE SAME Jun 20, 14 Sep 03, 15 THE CHARLES STARK DRAPER LABORATORY, INC.,
2015/0246,809 DEVICES WITH THINNED WAFER Mar 03, 14 Sep 03, 15 INFINEON TECHNOLOGIES AG,
2015/0246,810 INFRARED SENSOR DESIGN USING AN EPOXY FILM AS AN INFRARED ABSORPTION LAYER May 14, 15 Sep 03, 15 ,
2015/0249,026 ROOM-TEMPERATURE BONDING APPARATUS AND ROOM-TEMPERATURE BONDING METHOD Jul 30, 13 Sep 03, 15 MITSUBISHI HEAVY INDUSTRIES, LTD.,
2015/0239,732 SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF Feb 26, 14 Aug 27, 15 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,
2015/0239,733 SEMICONDUCTOR DIE WITH HIGH PRESSURE CAVITY Feb 24, 14 Aug 27, 15 FREESCALE SEMICONDUCTOR, INC.,
2015/0239,734 ELECTRONIC DEVICE Aug 01, 12 Aug 27, 15 PIONEER MICRO TECHNOLOGY CORPORATION,
2015/0244,289 VIBRATOR, MANUFACTURING METHOD THEREFOR, AND ELECTRONIC APPLIANCE Feb 18, 15 Aug 27, 15 SEIKO EPSON CORPORATION,
2015/0231,530 CENTRIFUGAL MICROFLUIDIC DEVICE Jun 22, 12 Aug 20, 15 ROYAL MELBOURNE INSTITUTE OF TECHNOLOGY,
2015/0232,323 Method for producing a micromechanical component, and micromechanical component Feb 17, 15 Aug 20, 15 ROBERT BOSCH GMBH,
2015/0232,324 NANO-ELECTROMECHANICAL SWITCH Apr 27, 15 Aug 20, 15 INTERNATIONAL BUSINESS MACHINES CORPORATION,
2015/0232,325 MICRO ELECTRO MECHANICAL SYSTEMS PACKAGE AND MANUFACTURING METHOD THEREOF Jan 09, 15 Aug 20, 15 CHIPMOS TECHNOLOGIES INC.,
2015/0232,326 METHOD OF SEALING AND SHIELDING FOR DUAL PRESSURE MEMS DEVICES Apr 29, 15 Aug 20, 15 TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.,
2015/0232,327 Sensor and Method for Manufacturing a Sensor Jan 30, 15 Aug 20, 15 ROBERT BOSCH GMBH,
2015/0232,328 Method for producing a wafer equipped with transparent plates Jan 30, 15 Aug 20, 15 ROBERT BOSCH GMBH,
2015/0232,329 Method for eutectic bonding of two carrier devices Feb 13, 15 Aug 20, 15 ROBERT BOSCH GMBH,
2015/0232,330 Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting Feb 04, 15 Aug 20, 15 ROBERT BOSCH GMBH,
2015/0232,331 LAYER STRUCTURE FOR A MICROMECHANICAL COMPONENT Feb 17, 15 Aug 20, 15 ROBERT BOSCH GMBH,
2015/0232,332 METHOD FOR SHIELDING MEMS STRUCTURES DURING FRONT SIDE WAFER DICING Feb 18, 14 Aug 20, 15 FREESCALE SEMICONDUCTOR, INC.,
2015/0235,779 MEMS Device with Constant Capacitance Feb 18, 14 Aug 20, 15 ANALOG DEVICES GLOBAL,

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Patents Issued To Date - By Filing Year

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