B81B 7/04

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Class  B81B : MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES


Subclass 7/04: Micro-structural systems Networks or arrays of similar micro-structural devices

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12253715 MEMS-driven optical package with micro-LED arrayAug 25, 20Mar 18, 25Not available
12252395 Method and system for sensor configurationOct 20, 22Mar 18, 25Not available
12234142 Device, method and computer-readable recording medium for detecting earthquake in mems-based auxiliary seismic observation networkAug 09, 22Feb 25, 25KOREA METEOROLOGICAL ADMINISTRATION; KYUNGPOOK NATIONAL UNIVERSITY INDUSTRY ACADEMIC COOPERATION FOUNDATION;
12234144 Method for sealing cavities using membranesAug 18, 20Feb 25, 25Commissariat A L' Energie Atomique Et Aux Energies Alternatives; Soitec;
12103843 MEMS mirror arrays with reduced crosstalkJan 11, 22Oct 01, 24CALIENT.AI INC.
12091160 Actively controlled surfacesAug 10, 22Sep 17, 24THE BOEING COMPANY
12024421 Devices, systems, and methods for obtaining sensor measurementsJul 06, 23Jul 02, 24Canon Solutions America, Inc.
11993512 Dual micro-electro mechanical system and manufacturing method thereofMar 14, 22May 28, 24TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
11962973 Combined corrugated piezoelectric microphone and corrugated piezoelectric vibration sensorFeb 06, 23Apr 16, 24Infineon Technologies AG
11912565 Micromechanical sensor unit and method for manufacturing a micromechanical sensor unitDec 17, 19Feb 27, 24502 Robert Bosch GmbH
11846651 Electrostatic actuator and physical quantity sensorOct 28, 20Dec 19, 23DENSO Corporation
11753295 MEMS device with electrodes and a dielectricDec 12, 22Sep 12, 23Knowles Electronics, LLC
11731870 Devices, systems, and methods for obtaining sensor measurementsAug 20, 20Aug 22, 23Canon Solutions America, Inc.
11736087 Coupled MEMS resonatorNov 08, 21Aug 22, 23KYOCERA Tikitin Oy
11479459 Method and system for sensor configurationJun 24, 20Oct 25, 22Not available
11473426 Methods to characterize wellbore fluid composition and provide optimal additive dosing using MEMS technologyJan 07, 22Oct 18, 22Halliburton Energy Services, Inc.
11447237 Actively-controlled superhydrophobic surfacesJul 10, 19Sep 20, 22The Boeing Company
11440002 Microfluidic chips with one or more vias filled with sacrificial plugsOct 23, 18Sep 13, 22IBM Corporation
11274037 Dual micro-electro mechanical system and manufacturing method thereofJul 24, 20Mar 15, 22Taiwan Semiconductor Manufacturing Co., Ltd.
11274038 Method for setting a pressure in a cavern formed with the aid of a substrate and of a substrate cap, semiconductor system, in particular, wafer systemDec 02, 19Mar 15, 22Robert Bosch GmbH

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0091,860 COMPOUND SENSOR AND MANUFACTURING METHODApr 05, 24Mar 20, 25Not available
2025/0008,220 MEMS-based Imaging DevicesJun 29, 23Jan 02, 25Microsoft Technology Licensing, LLC.
2024/0417,242 METHODS OF MANUFACTURE OF MEMS MIRROR ARRAYS WITH REDUCED CROSSTALKAug 30, 24Dec 19, 24CALIENT.AI INC.
2024/0277,252 MULTIPLEXED ANTIGEN-BASED DETECTION OF SARS-COV-2 AND OTHER DISEASES USING NANOMECHANICAL SENSORSJun 22, 22Aug 22, 24Not available
2024/0262,681 DUAL MICRO-ELECTRO MECHANICAL SYSTEM AND MANUFACTURING METHOD THEREOFApr 19, 24Aug 08, 24Taiwan Semiconductor Manufacturing Company Ltd.
2024/0140,022 DIGITAL LIGHT PROCESSING 3D PRINTED MONOLITHIC SUBSTRATES WITH INTEGRATED AND EMBEDDED SENSORSOct 31, 22May 02, 24Toyota Motor Engineering & Manufacturing North America, Inc.; Georgia Tech Research Corporation; Toyota Jidosha Kabushiki Kaisha;
2024/0025,733 MEMS MIRROR ARRAYS WITH REDUCED COUPLING BETWEEN MIRRORSJul 14, 23Jan 25, 24Calient Technologies, Inc.
2021/0382,085 COMBINED CORRUGATED PIEZOELECTRIC MICROPHONE AND CORRUGATED PIEZOELECTRIC VIBRATION SENSORJun 09, 20Dec 09, 21Not available
2021/0354,981 MICROMECHANICAL SENSOR UNIT AND METHOD FOR MANUFACTURING A MICROMECHANICAL SENSOR UNITDec 17, 19Nov 18, 21Not available
2020/0339,415 ARTIFICIAL MATERIALMay 11, 20Oct 29, 20Not available
2019/0318,885 MICROELECTROMECHANICAL DEVICE, WHICH CAN BE USED AS NON-VOLATILE MEMORY MODULE OR RELAY, AND MEMORY INCLUDING A PLURALITY OF MICROELECTROMECHANICAL DEVICESJun 26, 19Oct 17, 19Not available
2019/0119,104 MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICESJul 13, 16Apr 25, 19Hewlett-Packard Company
2018/0186,626 SYSTEM FOR CONTROLLING THE APPLICATION OF ENERGY TO A CONSTRUCTION COMPONENTDec 29, 17Jul 05, 18Not available

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