Class B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
Subclass 3/00: Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods (materials used for soldering B23K 35/00)
| Patent # | Title | Filing Date | Issue Date | Patent Owner |
|---|---|---|---|---|
| 12257649 | Soldering iron head and welding device | May 10, 23 | Mar 25, 25 | Tyco Electronics (Dongguan) Ltd.; TE Connectivity Solutions GMBH; Tyco Electronics (Shangha) Co., Ltd.; Kunshan League Automechanism Co., Ltd.; |
| 12262480 | Coating device and component mounting machine | Jul 17, 20 | Mar 25, 25 | FUJI CORPORATION |
| 12246398 | Solder bump forming member, method for manufacturing solder bump forming member, and method for manufacturing electrode substrate provided with solder bump | Dec 15, 20 | Mar 11, 25 | Resonac Corporation |
| 12233470 | Device and method for thermal joining, in particular for thermal joining of a heat exchanger for a motor vehicle | Apr 26, 19 | Feb 25, 25 | HANON SYSTEMS |
| 12237297 | Solder reflow apparatus and method of manufacturing an electronic device | Mar 28, 23 | Feb 25, 25 | Samsung Electronics Co. Ltd. |
| 12220768 | Solder paste bead recovery system and method | Aug 24, 23 | Feb 11, 25 | Illinois Tool Works Inc. |
| 12172238 | Soldering tip assembly for an electric soldering device, in particular a soldering iron, soldering device, and soldering system | Nov 09, 21 | Dec 24, 24 | ERSA GMBH |
| 12176317 | Semiconductor device manufacturing device and manufacturing method | Nov 12, 20 | Dec 24, 24 | SHINKAWA LTD. |
| 12176318 | Thermal compression bonder nozzle with vacuum relief features | Apr 03, 23 | Dec 24, 24 | Intel Corp. |
| 12154882 | Solder reflow apparatus and method of manufacturing an electronic device | Mar 27, 23 | Nov 26, 24 | Samsung Electronics Co. Ltd. |
| 12145218 | Flux transfer apparatus | Jul 20, 21 | Nov 19, 24 | SHINKAWA LTD. |
| 12115591 | Soldering apparatus | Nov 09, 22 | Oct 15, 24 | ERSA GMBH |
| 12114435 | Surface mount technology method and magnetic carrier system | May 13, 22 | Oct 08, 24 | SanDisk Technologies Inc. |
| 12103098 | Static vacuum welding furnace | Feb 07, 23 | Oct 01, 24 | SHANDONG CAIJU ELECTRONIC TECHNOLOGY CO. LTD |
| 12097575 | Soldering apparatus | Nov 08, 22 | Sep 24, 24 | ERSA GMBH |
| 12090577 | Device for soldering | Jun 05, 20 | Sep 17, 24 | WERKZEUGBAU SIEGFRIED HOFMANN GMBH |
| 12083626 | Solder supply unit, solder piece manufacturing device, part mounting device, and production system | Sep 22, 22 | Sep 10, 24 | HIRATA CORPORATION |
| 12069811 | Bonding apparatus | Jul 27, 22 | Aug 20, 24 | AUO CORPORATION |
| 12013185 | Reflow furnace | Dec 08, 20 | Jun 18, 24 | Illinois Tool Works Inc. |
| 11969828 | Prevention of dripping of material for material injection | Apr 06, 23 | Apr 30, 24 | IBM Corporation |
| Publication # | Title | Filing Date | Pub Date | Patent Owner |
|---|---|---|---|---|
| 2024/0344,771 | REFLOW FURNACE | Jun 12, 24 | Oct 17, 24 | Not available |
| 2023/0073,723 | DEVICE AND METHOD FOR OPTIMIZING CONTROL PARAMETER OF SOLDER PRINTING APPARATUS | May 31, 21 | Mar 09, 23 | Koh Young Technology Inc. |
| 2018/0015,558 | SOLDERING APPARATUS | Feb 25, 15 | Jan 18, 18 | FUJI MACHINE MFG. CO., LTD. |
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