B23K 1/19

Sub-Class

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Description

Class  B23K : SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM


Subclass 1/19: Soldering, e.g. brazing, or unsoldering (B23K 3/00 takes precedence; characterised only by the use of special materials or media B23K 35/00; dip or wave soldering in the manufacture of printed circuits H05K 3/34) taking account of the properties of the materials to be soldered

Recent Patents

Patent #TitleFiling DateIssue DatePatent Owner
12262477 Reprint apparatus for circuit board and reprint method using the sameFeb 17, 23Mar 25, 25SAMSUNG-ELECTRO-MECHANICS CO. LTD.
12142595 Apparatus and methods for tool mark free stitch bondingDec 21, 21Nov 12, 24Skyworks Solutions, Inc.
12128494 Semiconductor processing equipment with high temperature resistant nickel alloy joints and methods for making sameMay 15, 23Oct 29, 24Watlow Electric Manufacturing Company
12121998 Brazing a stacked body with a screenFeb 05, 21Oct 22, 24Mahle International GmbH; MAHLE FILTER SYSTEMS JAPAN CORPORATION;
12090564 Copper-ceramic joint body, brazing member and method of manufacturing copper-ceramic joint bodyMar 23, 23Sep 17, 24PROTERIAL, LTD.
12042875 Weld-brazing techniquesOct 25, 22Jul 23, 24GE Infrastructure Technology, LLC
12036627 Techniques and assemblies for joining componentsMay 23, 22Jul 16, 24Rolls-Royce Corporation
11987533 Ceramic matrix composite component and method of producing the sameNov 06, 18May 21, 24IHI CORPORATION
11986898 Laser brazing processJul 23, 20May 21, 24Ningbo Geely Automobile Research & Dev. Co., Ltd.
11980974 Solder joint part and method for manufacturing the sameOct 31, 19May 14, 24Nihon Superior Co. Ltd.; The University of Queensland;
11951583 Electrostatic chuck with high insulation performance and electrostatic attraction forceAug 31, 21Apr 09, 24NGK Insulators Ltd.
11948900 Bonded body, circuit board, and semiconductor deviceSep 02, 21Apr 02, 24KABUSHIKI KAISHA TOSHIBA; Toshiba Materials Co. Ltd.;
11939270 Production method for copper/ceramic joined body, production method for insulated circuit board, copper/ceramic joined body, and insulated circuit boardFeb 04, 20Mar 26, 24Mitsubishi Materials Corporation
11933441 Sensor arrangementNov 27, 19Mar 19, 24Danfoss A/S
11919288 Method for producing heat radiation memberSep 08, 21Mar 05, 24Dowa Metaltech Co., Ltd.
11834735 Copper-alloy stainless pipe, air conditioner including the same, and method of manufacturing the sameApr 25, 19Dec 05, 23LG Electronics Inc.
11831030 Method of forming a brazed joint having molybdenum materialMay 20, 19Nov 28, 23PACESETTER, INC.
11819915 Bonding member and bonding methodOct 18, 17Nov 21, 23Murata Manufacturing Co Ltd.
11813687 Aluminum alloy brazing sheet, method for manufacturing the same, aluminum alloy sheet, and heat exchangerJul 06, 21Nov 14, 23UACJ CORPORATION
11806799 Sinter brazing of powdered metal sinter hard matertial component to a wrought steel componentApr 15, 21Nov 07, 23Keystone Powdered Metal Company

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Recent Publications

Publication #TitleFiling DatePub DatePatent Owner
2025/0118,523 HIGH VOLTAGE VACUUM TUBESMay 16, 24Apr 10, 25Not available
2025/0118,704 APPARATUS AND METHODS FOR TOOL MARK FREE STITCH BONDINGNov 06, 24Apr 10, 25Not available
2025/0050,439 SEMICONDUCTOR PROCESSING EQUIPMENT WITH HIGH TEMPERATURE RESISTANT NICKEL ALLOY JOINTS AND METHODS FOR MAKING SAMEOct 29, 24Feb 13, 25Watlow Electric Manufacturing Company
2025/0018,489 Brazing Method, Brazed Joint, and BrazeSep 27, 24Jan 16, 25ABB Schweiz AG
2024/0416,443 Method for Producing a Solder Connection and Assembly with a Solder ConnectionOct 04, 22Dec 19, 24SIEMENS AKTIENGESELLSCHAFT
2024/0408,703 BONDING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING BONDING MATERIAL COMPOSITION, BONDING FILM, METHOD FOR MANUFACTURING BONDED BODY, AND BONDED BODYAug 20, 24Dec 12, 24FURUKAWA ELECTRIC CO., LTD.
2024/0365,475 REPRINT APPARATUS FOR CIRCUIT BOARD AND REPRINT METHOD USING THE SAMEJul 12, 24Oct 31, 24SAMSUNG-ELECTRO-MECHANICS CO. LTD.
2024/0316,667 ALUMINUM ALLOY BRAZING SHEET AND METHOD FOR MANUFACTURING THE SAMEAug 09, 22Sep 26, 24UACJ CORPORATION
2024/0306,262 Lamp Housing Braze Improvement for Semiconductor Rapid Thermal Processing (RTP) ChamberJul 17, 23Sep 12, 24Not available
2024/0271,874 HEAT EXCHANGE TUBEFeb 15, 24Aug 15, 24Not available
2024/0198,460 ENGINEERED MATERIALS FOR ELECTRONICS ASSEMBLYApr 14, 22Jun 20, 24Not available
2024/0173,787 TOOL AND MANUFACTURING METHOD OF ITMar 30, 22May 30, 24Seco Tools AB
2024/0165,725 FURNACE BRAZE CYCLE ENHANCEMENTNov 22, 22May 23, 24Not available
2024/0149,339 COMPOSITE SINTERED BODY, METHOD OF PRODUCING THE SAME, AND JOINING MATERIALMar 07, 22May 09, 24KAWASAKI JUKOGYO KABUSHIKI KAISHA
2024/0123,531 LASER BRAZING METHODFeb 22, 22Apr 18, 24JFE Steel Corporation
2024/0107,678 METHOD OF MANUFACTURING BONDED SUBSTRATE, METHOD OF MANUFACTURING CIRCUIT SUBSTRATE, AND CIRCUIT SUBSTRATENov 30, 23Mar 28, 24Not available
2024/0055,707 METHOD OF FORMING A BRAZED JOINT HAVING MOLYBDENUM MATERIALOct 26, 23Feb 15, 24Not available
2023/0226,630 JOINED BODY AND ELECTROSTATIC CHUCKJun 11, 21Jul 20, 23Not available
2023/0182,223 BRAZING METHODDec 09, 22Jun 15, 23Not available
2023/0150,048 BRAZED ALUMINUM MEMBER AND METHOD FOR PRODUCING BRAZED PRODUCTMar 26, 21May 18, 23UACJ CORPORATION

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