Method and arrangement for handling and processing substrates
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United States of America Patent
Stats
-
Nov 14, 2023
Grant Date -
N/A
app pub date -
Sep 18, 2020
filing date -
Sep 18, 2020
priority date (Note) -
In Force
status (Latency Note)
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Abstract
The invention relates to a substrate handling and exposure arrangement comprising a plurality of lithography apparatus, a clamp preparation unit for clamping a wafer on a wafer support structure, a wafer track, wherein the clamp preparation unit is configured for accepting a wafer from the wafer track, and an additional wafer track for transferring the clamp towards the plurality of lithography apparatus.
First Claim
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International Classification(s)
- 2020 Application Filing Year
- H01L Class
- 29783 Applications Filed
- 21134 Patents Issued To-Date
- 70.96 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 0 Citation Count
- H01L Class
- 0 % this patent is cited more than
- 2 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | May 14, 2027 |
| 7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | May 14, 2031 |
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | May 14, 2035 |