Lithography system, method of clamping and wafer table
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United States of America Patent
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Apr 11, 2023
Grant Date -
N/A
app pub date -
May 30, 2019
filing date -
Jul 13, 2007
priority date (Note) -
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status (Latency Note)
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Abstract
The invention relates to a lithography system, for example for projecting an image or an image pattern on to a target (1) such as a wafer, said target being included in said system by means of a target table (2), clamping means being present for clamping said target on said table. Said clamping means comprises a layer of stationary liquid (3), included at such thickness between target and target table that, provided the material of the liquid (C) and of the respective contacting faces (A, B) of the target (1) and target table (2), a pressure drop (PCap) arises.
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| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Oct 11, 2026 |
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