Light emitting device package and light unit
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United States of America
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Dec 21, 2021
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N/A
app pub date -
Apr 25, 2019
filing date -
Apr 25, 2019
priority date (Note) -
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Abstract
Embodiments provide a light emitting device package including a package body having a through-hole; a radiator disposed in the through-hole and including an alloy layer having Cu; and a light emitting device disposed on the radiator, wherein the alloy layer includes at least one of W or Mo, and wherein the package body includes cavity including a sidewall and a bottom surface, and wherein the through-hole is formed in the bottom surface.
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