Method and arrangement for attaching a chip to a printed conductive surface
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United States of America Patent
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May 26, 2020
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N/A
app pub date -
Jun 13, 2018
filing date -
Oct 14, 2010
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Abstract
A chip attached to and electrically connected with a printed conductive surface, whereby the chip is heated to a temperature, which is lower than what the chip can stand without being damaged by the heat, the heated chip is then pressed against the printed conductive surface with a pressing force, whereby a combination of said temperature and said pressing force is sufficient to at least partly melt the material of at least one of the printed conductive surface, the contact point on the chip, or both, thereby attaching and electrically connecting the chip to the printed conductive surface.
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