Substrate support providing gap height and planarization adjustment in plasma processing chamber
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United States of America Patent
Stats
-
Mar 5, 2019
Grant Date -
N/A
app pub date -
Oct 15, 2015
filing date -
Oct 15, 2015
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A semiconductor substrate support for use in a plasma processing apparatus comprises a chuck body having a plenum and three radially extending bores extending between the plenum and an outer periphery of the chuck body, wherein the chuck body is sized to support a semiconductor substrate having a diameter of at least 450 mm. The semiconductor substrate support further comprises three tubular support arms which include a first section extending radially outward from the outer periphery of the chuck body, and a second section extending vertically from the first section. The tubular support arms provide a passage therethrough which communicates with a respective bore in the chuck body. The second section of each tubular support arm is configured to engage with a respective actuation mechanism outside the chamber operable to effect vertical translation and planarization of the chuck body in the interior of a plasma processing chamber.
First Claim
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Family
International Classification(s)
- 2015 Application Filing Year
- H01J Class
- 2290 Applications Filed
- 1843 Patents Issued To-Date
- 80.49 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 1 Citation Count
- H01J Class
- 40.21 % this patent is cited more than
- 6 Age
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