Package board having internal terminal interconnection and semiconductor package employing the same
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jan 9, 2018
Grant Date -
N/A
app pub date -
Mar 16, 2014
filing date -
Jan 19, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
A package board is provided. The package board includes a board body having a front surface and a back surface. A first power pad, a first ground pad, a first signal pad, a first internal terminal pad and a second internal terminal pad are disposed on the front surface of the board body, and a second power pad, a second ground pad and a second signal pad are disposed on the back surface of the board body. The second power pad, the second ground pad and the second signal pad are electrically connected to the first power pad, the first ground pad and the first signal pad, respectively. An internal terminal interconnection is provided in a bulk region of the board body or on a surface of the board body. The internal terminal interconnection electrically connects the first internal terminal pad to the second internal terminal pad. A semiconductor package employing the package board is also provided.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2014 Application Filing Year
- H01L Class
- 23828 Applications Filed
- 21803 Patents Issued To-Date
- 91.51 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 3 Citation Count
- H01L Class
- 23.71 % this patent is cited more than
- 7 Age
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