Space transformers employing wire bonds for interconnections with fine pitch contacts
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United States of America Patent
Stats
-
Aug 6, 2013
Grant Date -
N/A
app pub date -
Dec 23, 2009
filing date -
Mar 20, 2006
priority date (Note) -
In Force
status (Latency Note)
Importance
Abstract
Method and apparatus for electrical testing of a device under test (DUT) that employs a connection board with signal contacts for applying test signals and a space transformer that has low pitch contacts arranged on one or more circumferential shelves that define an enclosure in the space transformer. The apparatus has a substrate with fine pitch contacts positioned such that these are within the enclosure. A set of wire bonds is used for pitch reduction by interconnecting the fine pitch contacts with the low pitch contacts arranged on the shelves. The probes are connected to the fine pitch contacts and are used to apply the test signals to a DUT by contacting its pads. In some embodiments, the fine pitch contacts may be embodied by plugs or by blind metal vias.
First Claim
Other Claims data not available
Family
International Classification(s)
- 2009 Application Filing Year
- G01R Class
- 3380 Applications Filed
- 2204 Patents Issued To-Date
- 65.21 % Issued To-Date
Cited Art Landscape
Patent Citation Ranking
- 11 Citation Count
- G01R Class
- 58.57 % this patent is cited more than
- 12 Age
Maintenance Fees
| Fee | Large entity fee | small entity fee | micro entity fee | due date |
|---|---|---|---|---|
| 11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 6, 2025 |