Method for containing a device and a corresponding device
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United States of America Patent
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May 28, 2013
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N/A
app pub date -
Jul 27, 2011
filing date -
Dec 24, 2003
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Abstract
A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element and providing an encapsulating wall surrounding the element extending between the base layer and the one or more encapsulating layers. An electrical connection is provided between the base layers and the one or more metallization layers formed above the micromechanical element.
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