Leadframe semiconductor integrated circuit device using the same, and method of and process for fabricating the two
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United States of America Patent
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Jun 5, 2012
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N/A
app pub date -
Nov 16, 2001
filing date -
Mar 27, 1992
priority date (Note) -
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Abstract
In order to improve the package body cracking resistance of an LSI package at the reflow soldering and to provide both a leadframe suitable for fabricating the LSI package according to the flexible manufacturing system and an LSI using the leadframe, the adhered area between a semiconductor chip 2 and a resin is enlarged by making the external size of a die pad 3 smaller than that of the semiconductor chip to be mounted thereon. Moreover, a variety of semiconductor chips 2 having different external sizes can be mounted on the die pad 3 by cutting the leading ends of leads 5 to a suitable length in accordance with the external sizes of the semiconductor chips 2.
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