Method of cutting material for use in implantable medical device
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United States of America Patent
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Oct 11, 2011
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N/A
app pub date -
Apr 22, 2010
filing date -
Jan 27, 2000
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Abstract
A method of cutting material for use in an implantable medical device employs a plotted laser cutting system. The laser cutting system is computer controlled and includes a laser combined with a motion system. The laser precisely cuts segments out of source material according to a predetermined pattern as designated by the computer. The segments are used in constructing implantable medical devices. The cutting energy of the laser is selected so that the cut edges of the segments are melted to discourage delamination or fraying, but communication of thermal energy into the segment beyond the edge is minimized to avoid damaging the segment adjacent the edge.
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