Low-cost circuit board materials and processes for area array electrical interconnections over a large area between a device and the circuit board
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United States of America Patent
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Jul 12, 2011
Grant Date -
N/A
app pub date -
Sep 6, 2007
filing date -
May 10, 2002
priority date (Note) -
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Abstract
An electronic device and coupled flexible circuit board and method of manufacturing. The electronic device is coupled to the flexible circuit board by a plurality of Z-interconnections. The electronic device includes a substrate with electronic components coupled to it. The substrate also has a plurality of device electrical contacts coupled to its back surface that are electrically coupled to the electronic components. The flexible circuit board includes a flexible substrate having a front surface and a back surface and a plurality of circuit board electrical contacts coupled to the front surface of the flexible substrate. The plurality of circuit board electrical contacts correspond to plurality of device electrical contacts. Each Z-interconnection is electrically and mechanically coupled to one device electrical contact and a corresponding circuit board electrical contact.
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