Method for plasma processing by shaping an induced electric field
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United States of America Patent
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Nov 10, 2009
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N/A
app pub date -
Jul 24, 2003
filing date -
Jan 12, 1993
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Abstract
A method for achieving a highly uniform plasma density on a substrate by shaping an induced electric field including the steps of positioning the substrate in a processing chamber, supplying a high frequency power to a spiral antenna generating an induced electric field in the processing chamber, generating a plasma in the processing chamber, and shaping the electric field with respect to the substrate to achieve a uniform distribution of plasma on the substrate being processed.
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