Fireplace
Number of patents in Portfolio can not be more than 2000
United States of America Design
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-
Sep 26, 2023
Grant Date -
N/A
app pub date -
Mar 10, 2023
filing date -
Jan 31, 2023
priority date (Note) -
In Force
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
HAN QIUMING | ZHEJIANG |
International Classification(s)

- 2023 Application Filing Year
- 2303 Class
- 138 Applications Filed
- 138 Patents Issued To-Date
- 100 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Han, Qiuming | Zhejiang, CN | 2 | 8 |
# of filed Patents : 2 Total Citations : 8 |
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Patent Citation Ranking
- 7 Citation Count
- 2303 Class
- 76.84 % this patent is cited more than
- 2 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Mar 26, 2027 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 26, 2031 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 26, 2035 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent No: 6710438
Enhanced chip scale package for wire bond dies
Abstract
A chip scale package assembly comprises an integrated circuit die wire bonded to a carrier for mounting to a printed circuit board. The carrier comprises top and bottom ground planes thermally and electrically bonded together by a number of grounded thermal vias. The top ground plane completely surrounds the wire bond signal connections made with the die, enhancing signal integrity. The top ground plane covers the die mounting area, providing grounding and heat spreading for the die. The thermal vias are also positioned in the mounting area, and thermally couple the die to the bottom-side ground plane. The bottom ground plane is positioned within a central area around which the signal connections from the top-side are arranged. Ground pads with attached solder balls are positioned within the bottom ground plane and conduct heat transferred from the die into a primary circuit board on which the carrier is mounted.
Description
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Legal Events
Date | Code | Event | Description |
---|---|---|---|
Jul 13, 2018 | AS | ASSIGNMENT | free format text: SECURITY INTEREST;ASSIGNOR:AMKOR TECHNOLOGY, INC.;REEL/FRAME:046683/0139 Owner name: BANK OF AMERICA, N.A., AS AGENT, CALIFORNIA Effective Date: Jul 13, 2018 |
Apr 23, 2012 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Mar 23, 2012 | FP | EXPIRED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Mar 23, 2012 |
Mar 23, 2012 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | |
Nov 07, 2011 | REMI | MAINTENANCE FEE REMINDER MAILED | |
Sep 21, 2007 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Nov 23, 2005 | AS� | SECURITY INTEREST | free format text: SECURITY AGREEMENT;ASSIGNOR:AMKOR TECHNOLOGY, INC.;REEL/FRAME:017379/0630 Owner name: BANK OF AMERICA, N.A., TEXAS Effective Date: Nov 23, 2005 |
Oct 27, 2004 | AS� | SECURITY INTEREST | free format text: SECURITY AGREEMENT;ASSIGNORS:AMKOR TECHNOLOGY, INC.;GUARDIAN ASSETS, INC.;REEL/FRAME:015320/0005 Owner name: CITICORP NORTH AMERICA, INC. AS AGENT, PENNSYLVANI Effective Date: Oct 27, 2004 free format text: SECURITY AGREEMENT;ASSIGNORS:AMKOR TECHNOLOGY, INC.;GUARDIAN ASSETS, INC.;REEL/FRAME:015942/0521 Owner name: CITICORP NORTH AMERICA, INC. AS 'AGENT', NEW YORK Effective Date: Oct 27, 2004 |
Mar 23, 2004 | I | Issuance | |
Aug 21, 2003 | P | Published | |
Mar 13, 2003 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YEO, YONG KEE;KHAN, NAVAS O.K.;IYER, MAHADEVAN K;REEL/FRAME:014070/0339 Owner name: INSTITUTE OF MICROELECTRONICS, JAPAN Effective Date: Mar 13, 2003 |
Feb 19, 2002 | F | Filing | |
Nov 02, 2001 | PD | Priority Date |

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