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United States of America Design
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Sep 19, 2023
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Mar 17, 2023
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
ZHU SHIYU | CHINA BANQIAO DISTRICT NEW TAIPEI CITY TAIWAN SHUANGSHI ROAD THREE NO 8 5 FLOOR 1 XINBEI CITY TAIWAN PROVINCE |
International Classification(s)

- 2023 Application Filing Year
- 0601 Class
- 342 Applications Filed
- 342 Patents Issued To-Date
- 100 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Zhu, Shiyu | Jiaxing, CN | 16 | 11 |
# of filed Patents : 16 Total Citations : 11 |
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- 0 Citation Count
- 0601 Class
- 0 % this patent is cited more than
- 2 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
3.5 Year Payment | $1600.00 | $800.00 | $400.00 | Mar 19, 2027 |
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Mar 19, 2031 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Mar 19, 2035 |
Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge - 3.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent No: 9905411
Method for processing semiconductor wafer, method for manufacturing bonded wafer, and method for manufacturing epitaxial wafer
Abstract
Method for processing a semiconductor-wafer having a front surface, back surface, and chamfered-portion composed of a chamfered surface on the front surface side, a chamfered surface on the back surface side, and an end face at a peripheral end, including: mirror-polishing of each portion of the chamfered surface on the front surface side, the chamfered surface on the back surface side, the end face, and an outermost peripheral-portion on the front or back surface adjacent to the chamfered surface; wherein the end face mirror-polishing and mirror-polishing of the outermost peripheral-portion on the front or back surface are performed in one step, after step of mirror-polishing the chamfered surface on the front surface side and step of mirror-polishing the chamfered surface on the back surface side; roll-off amount of the outermost peripheral-portion on the front or back surface is adjusted by one step-performed mirror-polishing of the end face and outermost peripheral-portion.
Description
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Legal Events
Date | Code | Event | Description |
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Aug 11, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Feb 27, 2018 | I | Issuance | |
Feb 07, 2018 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Oct 19, 2017 | P | Published | |
Dec 21, 2016 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MIYAZAWA, YUKI;KIDA, TAKAHIRO;TAKANO, TOMOFUMI;REEL/FRAME:041314/0836 Owner name: SHIN-ETSU HANDOTAI CO., LTD., JAPAN Effective Date: Dec 21, 2016 |
Aug 19, 2015 | F | Filing | |
Sep 11, 2014 | PD | Priority Date |

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