Elastic membrane for semiconductor wafer polishing apparatus

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United States of America Design

PATENT NO D808349
SERIAL NO

29574604

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Patent OwnerAddress
EBARA CORPORATION11-1 HANEDA ASAHI-CHO OTA-KU TOKYO 1448510

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Fukushima, Makoto Tokyo, JP 110 2059
Nabeya, Osamu Tokyo, JP 116 2177
Namiki, Keisuke Tokyo, JP 61 1664
Togashi, Shingo Tokyo, JP 47 1430
Yamaki, Satoru Tokyo, JP 41 1473
Yasuda, Hozumi Tokyo, JP 107 2107

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