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United States of America Design
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Aug 8, 2017
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Jan 26, 2016
filing date -
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
GPCP IP HOLDINGS LLC | 133 PEACHTREE STREET N E ATLANTA GA 30303 |
International Classification(s)

- 2016 Application Filing Year
- 0706 Class
- 148 Applications Filed
- 148 Patents Issued To-Date
- 100 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Rozek, Roy J | Neenah, US | 54 | 573 |
# of filed Patents : 54 Total Citations : 573 |
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- 4 Citation Count
- 0706 Class
- 0 % this patent is cited more than
- 8 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
7.5 Year Payment | $3600.00 | $1800.00 | $900.00 | Feb 8, 2025 |
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Feb 8, 2029 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 7.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent No: 9896765
Pre-treatment process for electroless plating
Abstract
The present invention discloses a process for electroless plating of a metal or metal alloy onto copper features of an electronic device such as a printed circuit board which suppresses undesired skip plating and extraneous plating. The process comprises the steps i) providing such a substrate, ii) activating of the copper features with noble metal ions; iii) removing excessive noble metal ions or precipitates formed thereof with an aqueous pre-treatment composition comprising an acid, a source for halide ions and an additive selected from the group consisting of thiourea, thiourea derivatives and polymers comprising thiourea groups, and iv) electroless plating of a metal or metal alloy layer.
Description
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Legal Events
Date | Code | Event | Description |
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Jun 28, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Dec 26, 2017 | I | Issuance | |
Dec 06, 2017 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Mar 05, 2015 | P | Published | |
Dec 12, 2014 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HILBRINK, MARCEL;XU, REX;ALVARADO, CESAR;AND OTHERS;SIGNING DATES FROM 20141119 TO 20141205;REEL/FRAME:034497/0046 Owner name: UNIVERSAL ELECTRONICS INC., CALIFORNIA |
Nov 07, 2014 | F | Filing | |
Sep 14, 2012 | AS | ASSIGNMENT | free format text: SECURITY INTEREST;ASSIGNOR:UNIVERSAL ELECTRONICS INC.;REEL/FRAME:067417/0402 Owner name: U.S. BANK NATIONAL ASSOCIATION, CALIFORNIA Effective Date: Sep 14, 2012 |

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