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United States of America Design
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Jul 8, 2014
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N/A
app pub date -
May 22, 2013
filing date -
Dec 21, 2006
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
---|---|---|
DELCOTTO IP LLC | 19 RENAISSANCE DRIVE NORTH HUNTINGDON PA 15642 |
International Classification(s)

- 2013 Application Filing Year
- 2699 Class
- 187 Applications Filed
- 187 Patents Issued To-Date
- 100 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Damiani, Justin | Youngwood, US | 13 | 165 |
# of filed Patents : 13 Total Citations : 165 | |||
Delcotto, Melynda Suzanne | North Huntingdon, US | 12 | 165 |
# of filed Patents : 12 Total Citations : 165 |
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- 16 Citation Count
- 2699 Class
- 0 % this patent is cited more than
- 11 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
---|---|---|---|---|
11.5 Year Payment | $7400.00 | $3700.00 | $1850.00 | Jan 8, 2026 |
Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge - 11.5 year - Late payment within 6 months | $160.00 | $80.00 | $40.00 |
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent No: 9876040
Method for manufacturing TFT substrate
Abstract
The present invention provides a method for manufacturing a TFT substrate, in which after induced crystallization is conducted by implanting ions into an amorphous silicon layer, there is no need to completely remove the ion induction layer formed on the surface of a poly-silicon layer so obtained and instead, a half-tone mask based operation is applied to remove only a portion of the ion induction layer corresponding to a channel zone and there is no need for re-conducting ion implantation subsequently for source/drain contact zones, thereby saving the mask necessary for re-conducting ion implantation. Further, the source/drain electrodes are also formed with the half-tone mask based operation so as to save the mask necessary for making the source/drain electrodes. Further, the source/drain electrodes are formed first so that the formation of an interlayer insulation layer can be omitted thereby saving the mask necessary for forming the interlayer insulation layer. Through the adoption of a half-tone mask base operation, the method for manufacturing a TFT substrate according to the present invention can reduce the nine masks that are involved in the prior art techniques to only six masks, thereby effectively simplifying the manufacturing process, improving manufacturing efficiency, and saving manufacturing cost.
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