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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
RAWLINGS SPORTING GOODS COMPANY INC	510 MARYVILLE UNIVERSITY DRIVE ST LOUIS MO 63141

International Classification(s)

• 0203:HEADWEAR

• 2012 Application Filing Year
• 0203 Class
• 117 Applications Filed
• 117 Patents Issued To-Date
• 100 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Eziquiel-Shriro, Jonathan	St. Louis, US	33	494
# of filed Patents : 33 Total Citations : 494
Farrar, Ryan	St. Louis, US	2	40
# of filed Patents : 2 Total Citations : 40
Hefer, Brandon	St. Louis, US	16	371
# of filed Patents : 16 Total Citations : 371
Hill, David	St. Louis, US	95	1188
# of filed Patents : 95 Total Citations : 1188
Schmidt, Marc	St. Louis, US	34	501
# of filed Patents : 34 Total Citations : 501
Snell, Justin	St. Louis, US	3	123
# of filed Patents : 3 Total Citations : 123

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Patent Citation Ranking

• 40 Citation Count
• 0203 Class

• 0 % this patent is cited more than
• 11 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Aug 18, 2025

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent No: 9755130

On-chip thermoelectric generator

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Abstract

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An on-chip thermoelectric generator comprises an integrated circuit comprising a substrate and at least one thermocouple integrated with the substrate, wherein the thermocouple is configured to convert a temperature difference into a voltage. A metal bump or metal pillar is thermally connected to a portion of the thermocouple for generating the temperature difference. The metal bump or metal pillar is electrically insulated from said at least one thermocouple. The metal bump or metal pillar is electrically connected to a component of the integrated circuit which is different from the thermocouple.

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Description

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Claims

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Legal Events

 

• MAFP2021
• PD2018
• I2018
• STCF2017
• P2016
• AS2014
• F2014

Date	Code	Event	Description
Jun 23, 2021	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4
Jan 10, 2018	PD	Priority Date
Jan 09, 2018	I	Issuance
Dec 20, 2017	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
May 05, 2016	P	Published
Oct 30, 2014	AS	ASSIGNMENT	free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:QI, GONGSHIN;PERRY, KEVIN L.;REEL/FRAME:034068/0023 Owner name: GM GLOBAL TECHNOLOGY OPERATIONS LLC, MICHIGAN Effective Date: Oct 30, 2014
Oct 29, 2014	F	Filing