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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
BANK OF AMERICA N A	900 W TRADE ST 6TH FLOOR CHARLOTTE NC 28255

International Classification(s)

• 1302:POWER TRANSFORMERS, RECTIFIERS, BATTERIES AND ACCU....

• 2010 Application Filing Year
• 1302 Class
• 197 Applications Filed
• 197 Patents Issued To-Date
• 100 % Issued To-Date

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Bear, John	Milton, US	10	410
# of filed Patents : 10 Total Citations : 410
Cronrath, Scott	Milton, US	9	296
# of filed Patents : 9 Total Citations : 296
Kovalkevich, Nick	Milton, US	10	191
# of filed Patents : 10 Total Citations : 191
Mendlinger, Layna	Milton, US	10	410
# of filed Patents : 10 Total Citations : 410
Montgomery, T Bruce	Milton, US	10	410
# of filed Patents : 10 Total Citations : 410
Qualls, Lee	Milton, US	10	410
# of filed Patents : 10 Total Citations : 410
Thimm, David	Walled Lake, US	35	928
# of filed Patents : 35 Total Citations : 928
Westbrook, Brian	Milton, US	9	270
# of filed Patents : 9 Total Citations : 270

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Patent Citation Ranking

• 14 Citation Count
• 1302 Class

• 0 % this patent is cited more than
• 12 Age

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent No: 9911678

Substrate with integrated heat spreader

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Abstract

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The present disclosure relates to a substrate with an integrated heat spreader. The disclosed substrate includes a substrate core, at least one connecting structure, and a heat spreader. The substrate core has a top surface and a bottom surface opposite the top surface of the substrate. The at least one connecting structure extends through the substrate core from the top surface of the substrate core to the bottom surface of the substrate core. And the heat spreader extends through the substrate core from the top surface of the substrate core to a bottom level that is below the bottom surface of the substrate core.

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Description

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Claims

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Claims data not available

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Legal Events

 

• MAFP2024
• MAFP2020
• AS2019
• I2017
• STCF2017
• P2015
• F2015
• PD2009

Date	Code	Event	Description
Dec 18, 2024	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 8
Sep 30, 2020	MAFP	MAINTENANCE FEE PAYMENT	free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4
Jul 01, 2019	AS	ASSIGNMENT	free format text: CHANGE OF NAME AND ADDRESS;ASSIGNOR:KYOWA HAKKO KIRIN CO., LTD.;REEL/FRAME:050797/0533 Owner name: KYOWA KIRIN CO., LTD., JAPAN Effective Date: Jul 01, 2019
Aug 08, 2017	I	Issuance
Jul 19, 2017	STCF	INFORMATION ON STATUS: PATENT GRANT	free format text: PATENTED CASE
Aug 06, 2015	P	Published
Apr 17, 2015	F	Filing
Jun 11, 2009	PD	Priority Date