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Sep 25, 2012
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Oct 12, 2011
filing date -
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Abstract
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- MAPING KOMMANDIITTIYHTIO L. HUOTARI;HUOTARI, MAPING KOMMANDITTIYHTIO L.
International Classification(s)

- 2011 Application Filing Year
- 1804 Class
- 10 Applications Filed
- 10 Patents Issued To-Date
- 100 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Huotari, Iisakki | Helsinki, FI | 18 | 19 |
# of filed Patents : 18 Total Citations : 19 | |||
Launto, Teemu | Turku, FI | 4 | 5 |
# of filed Patents : 4 Total Citations : 5 |
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Patent Citation Ranking
- 1 Citation Count
- 1804 Class
- 0 % this patent is cited more than
- 13 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent No: 9896765
Pre-treatment process for electroless plating
Abstract
The present invention discloses a process for electroless plating of a metal or metal alloy onto copper features of an electronic device such as a printed circuit board which suppresses undesired skip plating and extraneous plating. The process comprises the steps i) providing such a substrate, ii) activating of the copper features with noble metal ions; iii) removing excessive noble metal ions or precipitates formed thereof with an aqueous pre-treatment composition comprising an acid, a source for halide ions and an additive selected from the group consisting of thiourea, thiourea derivatives and polymers comprising thiourea groups, and iv) electroless plating of a metal or metal alloy layer.
Description
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Jun 28, 2021 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Dec 26, 2017 | I | Issuance | |
Dec 06, 2017 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Mar 05, 2015 | P | Published | |
Dec 12, 2014 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:HILBRINK, MARCEL;XU, REX;ALVARADO, CESAR;AND OTHERS;SIGNING DATES FROM 20141119 TO 20141205;REEL/FRAME:034497/0046 Owner name: UNIVERSAL ELECTRONICS INC., CALIFORNIA |
Nov 07, 2014 | F | Filing | |
Sep 14, 2012 | AS | ASSIGNMENT | free format text: SECURITY INTEREST;ASSIGNOR:UNIVERSAL ELECTRONICS INC.;REEL/FRAME:067417/0402 Owner name: U.S. BANK NATIONAL ASSOCIATION, CALIFORNIA Effective Date: Sep 14, 2012 |

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