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United States of America Design
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Apr 6, 2010
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Sep 3, 2008
filing date -
Mar 5, 2008
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Abstract
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
Patent Owner | Address | |
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DATALOGIC MOBILE S R L | VIA SAN VITALINO 13 LIPPO DI CALDERARA DI RENO (BO) I-40012 |
International Classification(s)

- 2008 Application Filing Year
- 1402 Class
- 57 Applications Filed
- 57 Patents Issued To-Date
- 100 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Alegiani, Monica | Silvi, IT | 37 | 853 |
# of filed Patents : 37 Total Citations : 853 | |||
Frison, Luigi | Mirano, IT | 3 | 45 |
# of filed Patents : 3 Total Citations : 45 |
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Patent Citation Ranking
- 17 Citation Count
- 1402 Class
- 0 % this patent is cited more than
- 15 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
---|---|---|---|
Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent No: 9694536
System and method for embossing the wire side of a molded fiber article
Abstract
A system and method for constructing a molded fiber article capable of having detailed indicia embossed thereon is provided. A molded fiber article having a smooth surface with detailed indicia is also provided. The system includes using a wire mesh structure coupled with an embossing plate such that the embossing plate imparts a smooth surface with indicia onto the molded fiber article during formation. The smooth surface if the embossing plate allows for greater detail than that of the textured surface created by the wire mesh structure. The system may also include a forming die that generally conforms to the wire mesh structure to facilitate formation of the molded fiber article. The wire mesh structure may include a recessed area for housing the embossing plate, which may be attached to the wire mesh structure using fasteners and a backing plate.
Description
Claims
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Legal Events
Date | Code | Event | Description |
---|---|---|---|
Nov 06, 2017 | STCH | INFORMATION ON STATUS: PATENT DISCONTINUATION | free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
Jul 20, 2015 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.) |
Jun 24, 2015 | FP | LAPSED DUE TO FAILURE TO PAY MAINTENANCE FEE | Effective Date: Jun 24, 2015 |
Jun 24, 2015 | LAPS | LAPSE FOR FAILURE TO PAY MAINTENANCE FEES | |
Jan 30, 2015 | REMI | MAINTENANCE FEE REMINDER MAILED | |
Nov 18, 2010 | FPAY | FEE PAYMENT | year of fee payment: 8 |
Sep 26, 2006 | FPAY | FEE PAYMENT | year of fee payment: 4 |
Jun 24, 2003 | I | Issuance | |
Feb 20, 2003 | P | Published | |
Oct 03, 2002 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:BAREFOOT, DAREK C.;WARNICK, DAVID R.;HOCHANADEL, THOMAS A.;AND OTHERS;REEL/FRAME:013358/0449;SIGNING DATES FROM 20020916 TO 20020920 Owner name: EKO SPORT, INC., COLORADO |
Aug 20, 2002 | F | Filing | |
Aug 20, 2001 | PD | Priority Date |

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