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United States of America Design
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Aug 25, 2009
Grant Date -
N/A
app pub date -
Feb 10, 2006
filing date -
Aug 12, 2005
priority date (Note) -
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Abstract
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- 15 United States
- 10 France
- 8 Japan
- 7 China
- 5 Korea
- 2 Other
Patent Owner(s)
- HIRSCHMANN CAR COMMUNICATION GMBH
International Classification(s)

- 2006 Application Filing Year
- 1403 Class
- 1175 Applications Filed
- 1175 Patents Issued To-Date
- 100 % Issued To-Date
Inventor(s)
Inventor Name | Address | # of filed Patents | Total Citations |
---|---|---|---|
Alber, Jörg | Reutlingen , DE | 1 | 6 |
# of filed Patents : 1 Total Citations : 6 | |||
Zhang, Ying | Leinfelden-echterdingen , DE | 923 | 12176 |
# of filed Patents : 923 Total Citations : 12176 |
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Patent Citation Ranking
- 6 Citation Count
- 1403 Class
- 0 % this patent is cited more than
- 16 Age
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Maintenance Fees
Fee | Large entity fee | small entity fee | micro entity fee | due date |
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Fee | Large entity fee | small entity fee | micro entity fee |
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Surcharge after expiration - Late payment is unavoidable | $700.00 | $350.00 | $175.00 |
Surcharge after expiration - Late payment is unintentional | $1,640.00 | $820.00 | $410.00 |
Full Text
US Patent No: 9326374
Flexible circuit board and process for producing the same
Abstract
A flexible circuit board comprises a substrate which has a polyimide layer recessed to define at least a compartment. The compartment includes an inner wall surface having a side wall and a bottom wall. The compartment is for containing a multilayer unit, wherein the multilayer unit includes an adhesion enhancing layer formed on the wall of the compartment, a first electrically conducting layer disposed on the adhesion enhancing layer, and a second electrically conducting layer formed on the first electrically conducting layer. The adhesion enhancing layer is palladium. The first electrically conducting layer is nickel. The substrate is composed of polyimide (PI).
Description
Claims
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Legal Events
Date | Code | Event | Description |
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Aug 29, 2023 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 8TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1552); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 8 |
Sep 16, 2019 | MAFP | MAINTENANCE FEE PAYMENT | free format text: PAYMENT OF MAINTENANCE FEE, 4TH YEAR, LARGE ENTITY (ORIGINAL EVENT CODE: M1551); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY year of fee payment: 4 |
Apr 26, 2016 | I | Issuance | |
Apr 06, 2016 | STCF | INFORMATION ON STATUS: PATENT GRANT | free format text: PATENTED CASE |
Aug 14, 2014 | P | Published | |
Aug 15, 2013 | F | Filing | |
Aug 12, 2013 | AS | ASSIGNMENT | free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:CHIU, CHIEN-HWA;CHAO, CHIH-MIN;KUO, PEIR-RONG;AND OTHERS;REEL/FRAME:031014/0768 Owner name: ICHIA TECHNOLOGIES,INC., TAIWAN Effective Date: Aug 12, 2013 |
Feb 08, 2013 | PD | Priority Date |

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