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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
TEL SAGAMI LIMITED A CORPORATION OF JAPAN	3210-1 AZA-HONGO KAWASHIRI SHIROYAMA-MACHI TSUKUI-GUN KANAGAWA-KEN

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• Non-US Classification not provided for expired patents

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Nakao, Ken	Sagamihara, JP	50	1531
Ohkase, Wataru	Sagamihara, JP	16	1296
Sato, Seishiro	Machida, JP	9	177

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent No: D326273

Heat insulating cylinder for thermal treatment of semiconductor wafers

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