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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
REDCOM LABORATORIES INC A N Y CORP	NY

International Classification(s)

• Non-US Classification not provided for expired patents

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Breidenstein, Charles J	Rochester, NY	9	259
Caplan, Jerome S	Henrietta, NY	6	195
Littlefield, Bruce G	Honeoye Falls, NY	5	127

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

Full Text

US Patent No: D275279

High density component mounting back panel for electronic equipment

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