Chipping-proof inorganic solid-state material and chipping-proof edge tool

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United States of America Patent

PATENT NO 9999983
SERIAL NO

13968514

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Abstract

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A chipping-proof nonmetal inorganic solid-state material is characterized in that the inorganic solid-state material has, in at least a part of a surface thereof, a surface structure in which a network of recesses and protuberances surrounded by the recesses are formed, the protuberances have an average width of 5 nm to 50 nm, a physical property of the surface structure differs from the physical property of an interior of the inorganic solid-state material lying below the surface structure, and there is no solid-solid interface between the surface structure and the interior of the inorganic solid-state material.

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Patent Owner(s)

Patent OwnerAddress
JAPAN AVIATION ELECTRONICS INDUSTRY LIMITED21-1 DOGENZAKA 1-CHOME SHIBUYA-KU TOKYO

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Sato, Akinobu Tokyo, JP 73 480
Suzuki, Akiko Tokyo, JP 125 1045

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