Printed circuit board and method for manufacturing the same
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United States of America Patent
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Jun 12, 2018
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N/A
app pub date -
Apr 20, 2016
filing date -
Sep 25, 2015
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Abstract
A printed circuit board and a method of manufacturing the same is described herein. The printed circuit board includes a first insulating layer having a first circuit embedded in a first surface thereof, a second insulating layer disposed on a second surface of the first insulating layer, the second insulating layer having a cavity therein, an electronic component mounted inside the cavity with an adhesion member, and a third insulating layer disposed on the second insulating layer to embed the electronic component.
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