Method for fabrication of an electronic module and electronic module

Number of patents in Portfolio can not be more than 2000

United States of America Patent

PATENT NO 9999136
APP PUB NO 20160174387A1
SERIAL NO

14569900

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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The present invention concerns an electronic module with at least one component embedded in insulating material. The electronic module comprises a first insulating material having a first surface and a second surface and a thickness between the first surface and the second surface, at least one opening through the first insulating material, a second insulating material on the second surface of the first insulating material, at least one component embedded in the second insulating material, at least one conductive pattern in the at least one opening, the at least one conductive pattern having a first surface and a second surface, wherein the second surface faces the second insulating material and the first surface faces away from the second insulating material and a distance between the first surface of the first insulating material and the second surface of the at least one conductive pattern is less or greater than the thickness of the first insulating material, an adhesive between the first insulating material and the at least one component, and connection elements between the at least one conductive pattern and the at least one component. The present invention further concerns a method for fabrication of an electronic module with at least one component embedded in an insulating layer.

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Patent Owner(s)

Patent OwnerAddress
R2 SOLUTIONS LLC6136 FRISCO SQUARE BLVD SUITE 400 FRISCO TX 75034

International Classification(s)

Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Tuominen, Risto Helsinki, FI 50 842

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