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• 15 United States
• 10 France
• 8 Japan
• 7 China
• 5 Korea
• 2 Other

Patent Owner(s)

Patent Owner	Address
MITSUBISHI GAS CHEMICAL COMPANY INC	TOKYO

International Classification(s)

• C08J:WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTE....
• C08G:MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN B....
• B32B:LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA....
• H05K:PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAIL....
• C08K:USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUB....

• [Classification Symbol]

• [Patents Count]

Inventor(s)

Inventor Name	Address	# of filed Patents	Total Citations
Kobayashi, Takashi	Tokyo, JP	692	7856
Takano, Kentaro	Tokyo, JP	82	461

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Maintenance Fees

Fee	Large entity fee	small entity fee	micro entity fee	due date
7.5 Year Payment	$3600.00	$1800.00	$900.00	Dec 12, 2025
11.5 Year Payment	$7400.00	$3700.00	$1850.00	Dec 12, 2029

Fee	Large entity fee	small entity fee	micro entity fee
Surcharge - 7.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge - 11.5 year - Late payment within 6 months	$160.00	$80.00	$40.00
Surcharge after expiration - Late payment is unavoidable	$700.00	$350.00	$175.00
Surcharge after expiration - Late payment is unintentional	$1,640.00	$820.00	$410.00

DATE PUBLISHED	PUBLICATION/PATENT NO.	PUBLICATION TYPE
June 12, 2018	US,9999126,B2   US9999126B2	GRANTED PATENT AS SECOND PUBLICATION
November 16, 2017	US,20170332487,A1   US20170332487A1	FIRST PUBLISHED PATENT APPLICATION

Full Text

US Patent No: 9999126

Resin composition for printed wiring board, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

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