Connection structure of circuit member, connection method, and connection material
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United States of America Patent
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Jun 12, 2018
Issued Date -
N/A
app pub date -
Mar 18, 2016
filing date -
Apr 23, 2015
priority date (Note) -
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status (Latency Note)
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Abstract
A connection structure of circuit members includes a first circuit member, a second circuit member, and a joint portion. The first circuit member has a first main surface on which a light-transparent electrode is provided. The second circuit member has a second main surface on which a metal electrode is provided. The joint portion is interposed between the first main surface and the second main surface. The joint portion includes a resin portion and a solder portion. The solder portion electrically connects the light-transparent electrode and the metal electrode. The light-transparent electrode contains an oxide that includes indium and tin, and the solder portion contains bismuth and indium.
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